Abstract:Due to the escalating demands for computational power, coupled with a continuous reduction in the size of electronic packaging, thermal management for electronic devices has become increasingly critical in recent years. Ensuring that the temperature of electronic chips remains below a certain threshold is essential, since overheating can result in a decline in performance and chip breakdowns. To address the intensive cooling needs of heat-emitting chips, a variety of devices and methods have been explored, such as heat pipes, vapor chambers, pool boiling, spray cooling, and jet impingement cooling. Tailoring thermal and chemical characteristics of the target heated surface is one of the key factors in enhancing heat removal efficiency. This study highlights the critical role of employing advanced surface engineering techniques which particularly focuses on the integration of a novel semi-layered microporous copper structure, developed in conformity with a multi-level micro-cubic pin fin silicon substrate. The semi-layered microporous copper structure is fabricated using polystyrene sphere as the template to assist the electrodeposition of copper, with a low current density being employed to ensure meticulous fabrication. The initial gradient of the muti-level substrate is defined using silicon dioxide as the mask, setting the depth to encapsulate the PS template effectively. This foundational layer is crucial for confining the PS template securely in place. The second gradient is defined using photoresist as the mask to etch micro pin fin structures into the substrate, aimed at enhancing the adhesion between the substrate and the PS template and expand the heat exchange area. This meticulous structuring prevents the template from detaching during large-scale electroplating operations, ensuring the integrity of the micro fabrication process. The semi-layered microporous copper and the multi-level micro-cubic pin fin silicon substrate are both strategically designed to augment nucleation sites and enlarge the heat exchange surface area during the boiling heat transfer process within a pool boiling system. Further enhanced by the jet flow disturbances aimed directly at the heat transfer surface, facilitating rapid bubble removal and liquid replenishment, which contributes to delaying the onset of dry out. By employing Novec 649 as the coolant under a jet flow rate of 2.5L/min, we've reached a critical heat flux of 90/Wcm2 on a semi-layered microporous copper structure over a large heated area of 1.5 x 1.5 cm. This research provides valuable knowledge that can inform the development of highly effective surface engineering designs in high heat flux management systems.

Parametric Study in Pool Boiling Enhancement with Self-Induced Jet Impingement on Sandblasted Pin-Fin Surfaces Using R1336mzz(Z)

Experimental and parametric study in pool boiling enhancement with self-induced jet impingement on the microporous copper surface using R1336mzz(Z)

Experimental Investigation on Self-Induced Jet Impingement Boiling Using R1336mzz(Z)

Nanoparticle-Assisted Pool Boiling Heat Transfer on Micro-Pin-Fin Surfaces

Pool Boiling Enhancement Via Surface Engineering for Thermal Management

POOL BOILING EXPERIMENT ON A MODIFIED MICROPIN-FINNED SURFACE WITH MECHANICAL OSCILLATION

Pool Boiling Heat Transfer of FC-72 on Pin-Fin Silicon Surfaces with Nanoparticle Deposition

EXPERIMENTAL STUDY ON POOL BOILING HEAT TRANSFER ENHANCEMENT WITH MICRO/NANOSTRUCTURED SURFACES

Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling

Enhanced Boiling Heat Transfer by Using Micro-Pin-Finned Surface in Three Different Test Systems

Experimental Study of Pool Boiling Heat Transfer on Novel Bistructured Surfaces Based on Micro-Pin-finned Structure

Pool Boiling Heat Transfer Enhancement on the Hybrid Surfaces Coupling Capillary Wick and Minichannels

Enhanced pool boiling on composite microstructured surfaces with microcavities on micro-pin-fins

Enhanced Heat Transfer Characteristic of Micro-Pin-Finned Surfaces With Jet Impingement

Enhanced Flow Boiling Heat Transfer with Jet Impingement on Micro-Pin-finned Surfaces

Enhancement of flow-jet combined boiling heat transfer of FC-72 over micro-pin-finned surfaces

Flow-jet boiling heat transfer enhancement on micro-pin-finned chips

Study of Saturated Pool Boiling Heat Transfer Characteristics of R1233zd(E) on Aluminum-Based Micro-Pin Finned Surfaces

Confined Submerged Jet Impingement Boiling of Subcooled Fc-72 over Micro-Pin-Finned Surfaces

ENHANCED HEAT TRANSFER OF FLOW BOILING COMBINED WITH JET IMPINGEMENT

Enhanced Nucleate Pool Boiling by Coupling the Pinning Act and Cluster Bubble Nucleation of Micro-nano Composited Surfaces