An Omnidirectional Antenna-in-Package Based on FOWLP for THz Chip-to-Chip Wireless Interconnect Applications

Gang Zhuang,Ya Fei Wu,Yang Chai,Yu Jian Cheng

DOI: https://doi.org/10.1109/gsmm61775.2024.10553188

2024-01-01

Abstract:This paper proposes an omnidirectional antenna-in-package (AiP) for THz chip-to-chip (C2C) wireless interconnect applications, based on fan-out wafer-level package (FOWLP). The microstrip monopolar patch antenna with 8 conductive vias is designed to motivate the TM01 pattern for achieving omnidirectional radiation and low profile, while additional directors are used to enhance the azimuthal plane gain. The meta-surface under the packaging mold is designed to decrease gain variation. Simulation results demonstrate that the antenna achieves an impedance band of -10 dB in the 216-231 GHz range. Additionally, within 220-230 GHz, the antenna can achieve a peak azimuthal plane gain of 2.7 dBi and gain variation is lower than 3 dB. This antenna provides a feasible solution for future terahertz C2C wireless interconnect applications.