POSS/EHTPB synergistically toughened epoxy resin for cryogenic application

Yu Zhang,Gang Wang,Yuxuan Xu,Jiajun Sun,Xiaohong Zhang,Ting Zheng,Lili Zhang

DOI: https://doi.org/10.1016/j.polymer.2024.127013

IF: 4.6

2024-01-01

Polymer

Abstract:The high brittleness of epoxy resin at cryogenic temperature restricts their wide application in cryogenic engineering. In this study, polyhedral oligomeric silsesquioxane (POSS) with -Si-O-Si- molecular chains were synthesized, and the mechanical properties of diglycidyl ether of bisphenol A (E51 epoxy resin) were significantly enhanced at room temperature (RT) by incorporating a 4% POSS and curing agent 4,4′-diamino-diphenylmethane (DDM) as the E51/POSS/DDM resin system. Subsequently, by adding different contents of epoxidation hydroxyl-terminated polybutadiene (EHTPB) into the E51/POSS/DDM resin system, the EHTPB-E51/POSS/DDM resin system was prepared. The investigation into the impact of EHTPB content on the mechanical properties of EHTPB-E51/POSS/DDM resin system at room temperature (RT) revealed that EHTPB-E51/POSS/DDM resin system with 10% EHTPB exhibited the most favorable results. Specifically, the elongation at break, flexural strength, and critical stress intensity factor (KIC) were measured to be 6.82%, 143.75 MPa, and 1.83 MPa·m1/2, respectively. These values demonstrated a notable improvement of 53.3%, 26.9%, and 86.7% compared to those for the E51/DDM resin system. Concurrently, at 77 K, the elongation at break and critical stress intensity factor (KIC) increased by 37.8% and 73.5%, respectively. The toughening mechanism of the prepared EHTPB-E51/POSS/DDM resin system was further explored through resin-curing cross-linking simulation networks and SEM images of the fracture surface of resin samples. The study of EHTPB and POSS synergistically toughened epoxy resin provided a new efficient method to prepare epoxy resins with high toughness at low temperatures.