Film Cooling and Stress Concentration Properties of the Backward-Diffusion Elliptical Hole

Shanyou Wang,Xueying Li,Jing Ren
DOI: https://doi.org/10.1016/j.applthermaleng.2024.122713
IF: 6.4
2024-01-01
Applied Thermal Engineering
Abstract:Film cooling is a commonly used cooling technology in gas turbines. However, it faces the problem of stress concentration. The present work proposes a low -stress film cooling hole with good cooling performance, namely the backward -diffusion elliptical hole. The Pressure Sensitive Paint experiments compare the film effectiveness of the backward -diffusion elliptical hole and the 7-7-7 fan -shaped hole. The film effectiveness of the backwarddiffusion elliptical hole is higher than that of the 7-7-7 fan -shaped hole, especially at high blowing ratios. The structure of the jet vortex system of the backward -diffusion elliptical hole is analyzed by large eddy simulation. The results show that the backward -diffusion elliptical hole induces a stronger anti -counter -rotating vortex pair than the elliptical hole. The anti -counter -rotating vortex pair weakens the harmful effects of the counter -rotating vortex pair on the film effectiveness. The stress concentration factor of the backward -diffusion elliptical hole is obtained by finite element analysis. The backward -diffusion elliptical hole's stress concentration factor is about 2.85, similar to the elliptical hole (2.84). However, the stress concentration factor of the 7-7-7 fan -shaped hole is 6.58. Therefore, the stress concentration factor for the backward -diffusion elliptical hole is only 43.3% of that for the 7-7-7 fan -shaped hole. The backward -diffusion elliptical hole is a more promising lowstress, high -cooling -efficiency film hole.
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