Abstract:Driven by the demand for computing power by artificial intelligence big data models, integrated circuit chips are developing in the direction of increasing the number of transistors and increasing the chip area, which results in an increase in power. Increased power of computing chips poses challenges for thermal management. In the trend of miniaturization of electronic devices, efficient heat dissipation of high-power electronic components in a restricted space is increasingly important. Single-phase liquid cooling with embedded microchannels in chips provides low thermal resistances and high-efficiency heat exchange in a compact manner. But at present embedded cooling is still in the laboratory stage, the liquid supply system used is large, the reliability test for the liquid supply system is less, and the embedded microchannel integrated cooling system with liquid supply capacity needs to be further miniaturized. In this paper, an integrated thermal management method integrating pump and embedded microfluidics for high power chips is proposed, and the prototype of the microsystem is designed and developed. The overall size of the system is less than 13 cm3. A platinum film resistor is designed on the surface of embedded microchannel chip to simulate the heat dissipation of an actual chip. The liquid supply part is manufactured by 3D printing technology. The cooling capability of embedded microchannel and the liquid flow reliability of integrated embedded microfluidic system were tested respectively. The results show that when the chip power is 206W, the chip surface temperature rise can be controlled below 75°C. Under the flow rate of 118ml/min, after 96 hours of continuous cooling test, the system shows no reliability problems such as leakage and structural damage. This work integrates the embedded microchannel liquid cooling system as a whole and miniaturizes the system on the premise of ensuring its heat dissipation ability and working reliability, which has practical significance to promote the integration and industrialization of embedded cooling.

Flexible Thermal Management Method for High-Power Chips in the Humanoid Robot

Self-adaptive Passive Temperature Management for Silicon Chips Based on Near-Field Thermal Radiation

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin.

Theoretical Design of Smart Bionic Skins with Self-Adaptive Temperature Regulation

Functional Soft Composites As Thermal Protecting Substrates For Wearable Electronics

Biomimetic Passive Skin Cooling For High-End Handheld Devices

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

Ultrathin, soft, radiative cooling interfaces for advanced thermal management in skin electronics

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Hydraulic-driven Adaptable Morphing Active-Cooling Elastomer with Bioinspired Bicontinuous Phases

A Miniaturized Integrated System for Embedded Microchannel Cooling with Manifolds

An Automatic and Portable Prosthetic Cooling Device with High Cooling Capacity Based on Phase Change

Highly Precise Multifunctional Thermal Management-Based Flexible Sensing Sheets

Ultrathin Conformal Devices for Precise and Continuous Thermal Characterization of Human Skin

Skin-integrated systems for power efficient, programmable thermal sensations across large body areas

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

Soft, Body Conformable Electronics for Thermoregulation Enabled by Kirigami

An adaptive thermal management method via bionic sweat pores on electronic devices

Highly Efficient Multi-Layer Flexible Heatsink for Wearable Thermoelectric Cooling

Thermal Management of Flexible Wearable Electronic Devices Integrated with Human Skin Considering Clothing Effect

Multi-bioinspired Flexible Thermal Emitters for All-Day Radiative Cooling and Wearable Self-Powered Thermoelectric Generation