Nonlocal Thermomechanical Coupled Modeling Method for Two-dimensional Rolling Contact Using a Peridynamic Approach
Xiaoming Wang,Boyang An,Qing He,Ping Wang,Wenjian Wang,Jun Huang
DOI: https://doi.org/10.1016/j.apm.2023.07.023
IF: 5.336
2023-08-02
Applied Mathematical Modelling
Abstract:The development of thermomechanical coupled simulations for rolling contacts is challenging when the adjacent material is temperature-dependent or when there are cracks or other discontinuities on the contact surface. This paper proposes a novel thermomechanical coupled modeling method for rolling contacts using a nonlocal peridynamic (PD) approach. Fully coupled, ordinary state-based PD thermomechanical equations for the plane strain and plane stress cases are derived based on the strain-energy density, including thermal coupling terms, and detailed information on each parameter is provided. Subsequently, an algorithm for rolling thermal contacts in PD is proposed based on the penalty method. This study further provides a detailed modeling process and an algorithm for the proposed method based on a multi-rate time-integration scheme for numerical implementation. A typical two-dimensional (2D) wheel–rail rolling contact model is established to evaluate the performance of the proposed contact modeling method in wheel–rail thermal contact and to analyze the influence of temperature-dependent material and rail-surface cracks on the thermomechanical response. It is found that the contact stress and rail-surface temperature rise in the case of small creepages and temperature-independent materials are in good agreement with the analytical solution. In the case of large creepages, the mechanical and temperature results of using temperature-dependent materials and temperature-independent materials are quite different, and the frictional heat generated can cause martensitic transformation of adjacent materials. Rail-surface cracks cause a sharp increase in the contact stress and temperature rise near the cracks, and the high temperature also promotes crack growth.
mechanics,engineering, multidisciplinary,mathematics, interdisciplinary applications