Cu/Sn-58Bi/Ni焊点液-固电迁移下Cu和Ni的交互作用

黄明亮,冯晓飞,赵建飞,张志杰

2015-01-01

Abstract:Cu/Sn-58Bi/Ni interconnect was prepared by dip-soldering, the effects of liquid-solid electromigration liquid-solid electromigration (L-S EM) on the Cu-Ni cross-solder interaction and the interfacial reaction in Cu/Sn-58Bi/Ni interconnects were investigated at current density of 5×103 A/cm2 and 170 ℃. Regardless of the current direction, a polarity effect is observed in Cu/Sn-58Bi/Ni interconnects undergoing liquid-solid electromigration (L-S EM), i.e., the interfacial intermetallic compound (IMC) at the anode grows continuously and is obviously thicker than that at the cathode. EM significantly enhances the interaction between Cu and Ni atoms. When electrons flow from Ni to Cu, the diffusion of Ni atoms are significantly enhanced by the combining effect of chemical potential gradient and electronic wind, resulting in the formation of (Cu,Ni)6Sn5 at the anode Cu interface, while a certain amount of Cu atoms diffuse to the Ni cathode interface under upwind diffusion, resulting in the formation of (Cu,Ni)6Sn5. When electrons flow from Cu to Ni, a large number of Cu atoms diffuse to the anode Ni interface, resulting in the formation of (Cu,Ni)6Sn5 IMC. However, Ni atoms are difficult to diffuse to the cathode Cu interface under upwind diffusion, thus, Cu6Sn5 IMC remains at the cathode. Furthermore, regardless of the current direction, Bi atoms do not segregate undergoing electromigration (EM).