A phase field model for cohesive fracture in micropolar continua
Hyoung Suk Suh,WaiChing Sun,Devin T. O’Connor
DOI: https://doi.org/10.1016/j.cma.2020.113181
IF: 6.588
2020-09-01
Computer Methods in Applied Mechanics and Engineering
Abstract:<p>While crack nucleation and propagation in the brittle or quasi-brittle regime can be predicted via variational or material-force-based phase field fracture models, these models often assume that the underlying elastic response of the material is not size-dependent. Yet, a length scale parameter must be introduced to these models to enable sharp cracks properly represented by a regularized implicit function. However, many materials with internal microstructures that contain surface tension, micro-cracks, micro-fracture, inclusion, cavity or those of particulate nature often exhibit size-dependent behaviors in both the path-independent and path-dependent regimes. This paper is intended to introduce a unified treatment that captures the size effect of the materials in both elastic and damaged states. By introducing a cohesive micropolar phase field fracture theory, along with the computational model and validation exercises, we explore the interacting size-dependent elastic deformation and fracture mechanisms exhibits in materials of complex microstructures. To achieve this goal, we introduce the distinctive degradation functions of the force-stress–strain and couple-stress-micro-rotation energy-conjugated pairs for a given regularization profile such that the macroscopic size-dependent responses of the micropolar continua are insensitive to the length scale parameter of the regularized interface. Then, we apply the variational principle to derive governing equations from the micropolar stored energy and dissipative functionals. Numerical examples are introduced to demonstrate the proper way to identify material parameters and the capacity of the new formulation to simulate complex crack patterns in the quasi-static regime.</p>
mechanics,engineering, multidisciplinary,mathematics, interdisciplinary applications