Abstract:Poor DRAM technology scaling over the course of many years has caused DRAM-based main memory to increasingly become a larger system bottleneck. A major reason for the bottleneck is that data stored within DRAM must be moved across a pin-limited memory channel to the CPU before any computation can take place. This requires a high latency and energy overhead, and the data often cannot benefit from caching in the CPU, making it difficult to amortize the overhead. Modern 3D-stacked DRAM architectures include a logic layer, where compute logic can be integrated underneath multiple layers of DRAM cell arrays within the same chip. Architects can take advantage of the logic layer to perform processing-in-memory (PIM), or near-data processing. In a PIM architecture, the logic layer within DRAM has access to the high internal bandwidth available within 3D-stacked DRAM (which is much greater than the bandwidth available between DRAM and the CPU). Thus, PIM architectures can effectively free up valuable memory channel bandwidth while reducing system energy consumption. A number of important issues arise when we add compute logic to DRAM. In particular, the logic does not have low-latency access to common CPU structures that are essential for modern application execution, such as the virtual memory and cache coherence mechanisms. To ease the widespread adoption of PIM, we ideally would like to maintain traditional virtual memory abstractions and the shared memory programming model. This requires efficient mechanisms that can provide logic in DRAM with access to CPU structures without having to communicate frequently with the CPU. To this end, we propose and evaluate two general-purpose solutions that minimize unnecessary off-chip communication for PIM architectures. We show that both mechanisms improve the performance and energy consumption of many important memory-intensive applications.

Bumblebee: A MemCache Design for Die-stacked and Off-chip Heterogeneous Memory Systems.

A design framework for processing-in-memory accelerator

DEAM：Decoupled, Expressive, Area-Efficient Metadata Cache

Modeling and Benchmarking Computing-in-Memory for Design Space Exploration.

Die-Stacked DRAM: Memory, Cache, or MemCache?

CHIME: Energy-Efficient STT-RAM-based Concurrent Hierarchical In-Memory Processing

Monarch: A Durable Polymorphic Memory For Data Intensive Applications

A hybrid memory architecture supporting fine-grained data migration

A Novel Architecture Of The 3d Stacked Mram L2 Cache For Cmps

Phoenix: A Dynamically Reconfigurable Hybrid Memory System Combining Caching and Migration

Demystifying the Characteristics of 3D-Stacked Memories: A Case Study for Hybrid Memory Cube

Architecting On-Chip Interconnects for Stacked 3D STT-RAM Caches in CMPs

Enabling the Adoption of Processing-in-Memory: Challenges, Mechanisms, Future Research Directions

HAM: Hotspot-Aware Manager for Improving Communications With 3D-Stacked Memory

Hardware Architecture and Software Stack for PIM Based on Commercial DRAM Technology : Industrial Product

Optimizing B + -Tree for Hybrid Memory with In-Node Hotspot Cache and Eadr Awareness

A$^3$PIM: An Automated, Analytic and Accurate Processing-in-Memory Offloader

DPA: Demand-Based Partition and Data Allocation for Hybrid On-Chip Memory

An Energy-Efficient Heterogeneous Memory Architecture for Future Dark Silicon Embedded Chip-Multiprocessors

Hotspot-Aware Hybrid Memory Management for In-Memory Key-Value Stores

Exploring DRAM Cache Prefetching for Pooled Memory