Abstract:BACKGROUND:Conventional approaches of making a flexible circuit are generally complex, environment unfriendly, time and energy consuming, and thus expensive. Here, we describe for the first time the method of using high-performance GaIn(10)-based electrical ink, a significantly neglected room temperature liquid metal, as both electrical conductors and interconnects, for directly writing flexible electronics via a rather easy going and cost effective way.METHODS:The new generation electric ink was made and its wettability with various materials was modified to be easily written on a group of either soft or rigid substrates such as epoxy resin board, glass, plastic, silica gel, paper, cotton, textiles, cloth and fiber etc. Conceptual experiments were performed to demonstrate and evaluate the capability of directly writing the electrical circuits via the invented metal ink. Mechanisms involved were interpreted through a series of fundamental measurements.RESULTS:The electrical resistivity of the fluid like GaIn(10)-based material was measured as 34.5 µΩ·cm at 297 K by four point probe method and increased with addition of the oxygen quantity, which indicates it as an excellent metal ink. The conductive line can be written with features that are approximately 10 µm thick. Several functional devices such as a light emitting diode (LED) array showing designed lighting patterns and electrical fan were made to work by directly writing the liquid metal on the specific flexible substrates. And satisfactory performances were obtained.CONCLUSIONS:The present method opens the way to directly and quickly writing flexible electronics which can be as simple as signing a name or drawing a picture on the paper. The unique merit of the GaIn(10)-based liquid metal ink lies in its low melting temperature, well controlled wettability, high electrical conductivity and good biocompability. The new electronics writing strategy and basic principle has generalized purpose and can be extended to more industrial areas, even daily life.

Direct fabrication of liquid-metal multifunctional paper based on force-responsive adhesion

Self-sintering liquid metal ink with LAPONITE? for flexible electronics

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

Enhanced Adhesion Between Liquid Metal Ink and the Wetted Printer Paper for Direct Writing Electronic Circuits

One‐Step Liquid Metal Transfer Printing: Toward Fabrication of Flexible Electronics on Wide Range of Substrates

3Dp-Ori: Bridging-Printing Based Origami Fabrication Method with Modifiable Haptic Properties

Multi‐Substrate Liquid Metal Circuits Printing via Superhydrophobic Coating and Adhesive Patterning

Versatile fabrication of liquid metal nano-ink based flexible electronic devices

Semi-liquid Metal and Adhesion-Selection Enabled Rolling and Transfer (SMART) Printing: A General Method Towards Fast Fabrication of Flexible Electronics

Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits

Tunable and Reversible Adhesive of Liquid Metal Ferrofluid Pillars for Magnetically Actuated Noncontact Transfer Printing

FOLDABLE PAPER ELECTRONICS BY DIRECT-WRITE LASER PATTERNING

Direct-Writing Flexible Metal Circuit with Polymer/Metal Precursor Ink and Interfacial Reaction

A Rapid and Straightforward Liquid Metal Patterning Technique on Paper Using Laser Printer for Soft Electronics

Suspension printing of liquid metal in yield-stress fluid for resilient 3D constructs with electromagnetic functions

Liquid metal enabled conformal electronics

Liquid Metal-Based Devices: Material Properties, Fabrication and Functionalities

Direct Writing of Flexible Electronics Through Room Temperature Liquid Metal Ink.

Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits

Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

Revolutionizing flexible Electronics: Integrating liquid metal DIW 3D printing by bimolecular interpenetrating network