Microstructure of Al-20% Sn-4.5% Cu Alloy During High Energy Ball Milling and Sintering Processes

Zeng Meiqin

2009-01-01

Abstract:Al-20%Sn-4.5%Cu alloy powder was prepared by high energy ball milling.Microstructure of the alloy during high energy ball milling and sintering processes was characterized by X-ray diffraction(XRD),scanning electron microscopy(SEM)and differential scanning calorimetry(DSC).The results show that Sn nanoparticles are dispersed homogeneously in Al matrix microstructure by milling for 40 h in Al-20%Sn-4.5%Cu alloy powder.Meanwhile,Al(Cu)supersaturated solid solution is formed during the milling process.In subsequent sintering process,Sn phase grows but the size still retains about 200 nm,and CuAl2 phase precipitates from Al(Cu)supersaturated solid solution.