Abstract:The investigations on half-mode substrate integrated waveguide (HMSIW)optimized foruseinhigh-speed bandpass digital interconnects isreported inthispaper.Itis knownthatthesubstrate integrated waveguide (SIW)hasbeen successfully proposedand usedin ultrahigh-speed digital interconnects. Thestructure features low-loss, low-crosstalk and easy-to- fabricate inplanar formusing astandard printed circuit board(PCB)process. Thenovelty ofimplementing HMSIW in thecaseofinterconnects isthatitcanreduce theSIWtransverse widthbynearly 50%,andhasamuchwiderbandwidth thanthat ofSIW.TheHMSIW structure exhibits lowlossandleakage whentested attensofGHzfrequency range. Moreover, thenear- endandthefar-end cross-talks ofHMSIW indenselayout are showntohaveabetter performance thanthose ofmicrostrip line. HMSIW also canbeeasily bendedtoadaptdifferent layout. Index Terms-HMSIW, SIW,High-Speed Interconnects, Crosstalk, Bend

Investigations Onhalf-Mode Substrate Integrated Waveguide Forhigh-Speed Interconnect Application