Comprehensive Performance of Polyimide Reinforced by Multiple Hydrogen Bonds for Flexible Electronics Application

Tao Chen,Xiaojie He,Qinghua Lu
DOI: https://doi.org/10.1021/acsapm.3c00767
2023-01-01
ACS Applied Polymer Materials
Abstract:Multiplehydrogen bonds (multi-HBs) can not only realize supramolecularpolymerization but also significantly improve the mechanical propertiesof materials. Although it is known that hydrogen bonding can strengthenpolymeric properties, the effect of multi-HBs has not been exploredfor high-performance polymers, especially polyimides (PIs). Here,a diamine monomer capable of forming multi-HBs, N,N '-(6-oxo-1,6-dihydropyrimidine-2,5-diyl)-bis(4-aminobenzamide)(DAPyBA), has been successfully designed and synthesized, and correspondingPI films have been prepared by polymerization of DAPyBA and 4,4-diaminodiphenylether (ODA) at different molar ratios with pyromellitic dianhydride(PMDA). All the PI films exhibited excellent heat resistance, withglass transition temperatures (T (g)) rangingfrom 354 to 397 degrees C and 5% weight loss temperatures (T (d5)) in the range from 455 to 574 degrees C. All the filmsalso showed good mechanical properties and low coefficients of thermalexpansion (CTE), and the mechanical properties and thermal dimensionalstability of the PIs improved with increasing DAPyBA content due tothe formation of multi-HBs. In particular, PI-50 presented a hightensile modulus (5.2 GPa), a low CTE (6.7 ppm K-1), and a high T (g) (354 degrees C), meetingthe requirements of the flexible electronics and flexible printedcircuit board. Meanwhile, the introduction of DAPyBA can effectivelyincrease the adhesion of PI films on substrates due to the high contentsof N and O atoms therein.
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