Electrical structure of the fault system in the Tangyin graben, eastern margin of the Taihangshan uplift, China: Inferences from magnetotelluric imaging

Xiangyu Sun,Yan Zhan,Xiaoping Yang,Qing Zhou,Xintang Feng,Lingqiang Zhao,Xuehua Liu
DOI: https://doi.org/10.1016/j.jseaes.2023.105631
IF: 3
2023-01-01
Journal of Asian Earth Sciences
Abstract:We present three-dimensional magnetotelluric images across the southern segment of the Taihangshan uplift and the Tangyin graben. Distinct electrical structures are recognized between these two regions. The upper crust of the southern segment of the Taihangshan uplift is characterized by a high resistivity structure, and the underlying middle and lower crust contain a high conductivity layer. On the eastern side of the uplift, the upper crust contains a high conductivity structure in the Tangyin graben and a high resistivity structure in the Neihuang uplift. The lower crust is dominated by a single coherent high resistivity structure. The Tangxi fault, Tangdong fault, and the western margin fault of the Neihuang uplift collectively form a flower structure, wherein the Tangdong fault is dominant. Three-dimensional inversion is also carried out for magnetotelluric profiles across the central-northern segment of the Taihangshan uplift and the Shijiazhuang-Jinxian depression to serve as a comparison for the southern portion of the Taihangshan uplift. The central-northern segment of the Taihangshan uplift is characterized by a high resistivity structure. The upper crust of the Shijiazhuang-Jinxian depression is characterized by a combination of a high conductivity graben and a high resistivity adjacent uplift. The deep electrical structure of the Tangdong fault and the associated concealed subvertical electrical boundary zone are quite similar to the electrical structure in the vicinity of the 1966 Xingtai earthquake. We conclude that the existence of tectonic conditions in the middle and lower crust of the Tangyin graben might be capable of creating moderate to strong earthquakes.
What problem does this paper attempt to address?