Abstract:The paper is aimed at presenting pyrolysis characteristic features and dynamic analysis of waste FR1 phenol resin printing circuit board based on the current development situation of the pyrolysis-incineration technology.The pyrolysis properties of FR1 flame retardant phenolic resin printed circuit boards were characterized by thermo-gravimetric (TG) apparatus at different heating rates (10 K/min,20 K/min,30 K/min) in N2.With the two typical multiple scanning methods of Kissinger and FWO pyrolysis kinetics analysis models,three thermal decomposition kinetic parameters including the average apparent activation energy,we have calculated,analyzed and deduced the pre-exponential factor and the reaction order in spite of the difficulties of pyrolysis reaction and thermal treatment.The TG experimental results we have gained show that the pyrolysis process can be divided into two stages,that is,the first stage to be accomplished at the temperatures from the room one to that of 180 ℃,while the second stage can be done from 180 ℃ to 580 ℃.In addition,the heating process has to be done at a heating rate of 20 K/rmin so as to make the maximum weight-losing rate with the thermally-degraded FR1 PCB samples by 7 1.51％,resulting in little residue left-over from the full thermal degradation process.Under the dynamic model the pyrolysis process is supposed to be taken as the first order reaction.Moreover,the Kissinger calculation method proves that the average visible activated energy can be expected to reach 170.83 kJ/mol with the pre-exponential factor A being 7.41 × 1014min-1.Besides,the FWO calculation method tends to show the correlation coefficient r can be expected to reach its maximum extent over 99％ whereas the average apparent activation energy E can reach 169.71 kJ/mol when the conversion rate is 0.3-0.5(relating to the maximum TGA range).Thus,it can be seen that the supposed models are reasonable for the results of the both methods turn to be agreeable.Last of all,as compared to the pyrolysis dynamic parameters like the average apparent activation energy and pre-exponential factor,it can be found that the former and the latter parameters ofthe tested phenol resin circuit board should be 1.03 and 0.76 times & 224 and 48 times by those of epoxy resin board and Teflon circuit board respectively.This implies that the tested board proves much easier to be fully carried out at the thermal degradation processes than the other two.It also means that this kind of hazardous E-waste products can be easily dealt with via the consecutive pyrolysis-incineration technology.However,the gist of this study lies in its exploration of the feasibility of the so-called novel thermal processing technology on the phenol resin circuit boards with the flame retardants and the correlated fundamental data.

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