15.5 A 28nm 64Kb 6T SRAM Computing-in-Memory Macro with 8b MAC Operation for AI Edge Chips
Xin Si,Yung-Ning Tu,Wei-Hsing Huanq,Jian-Wei Su,Pei-Jung Lu,Jing-Hong Wang,Ta-Wei Liu,Ssu-Yen Wu,Ruhui Liu,Yen-Chi Chou,Zhixiao Zhang,Syuan-Hao Sie,Wei-Chen Wei,Yun-Chen Lo,Tai-Hsing Wen,Tzu-Hsiang Hsu,Yen-Kai Chen,William Shih,Chung-Chuan Lo,Ren-Shuo Liu,Chih-Cheng Hsieh,Kea-Tiong Tang,Nan-Chun Lien,Wei-Chiang Shih,Yajuan He,Qiang Li,Meng-Fan Chang,Wei-Hsing Huang
DOI: https://doi.org/10.1109/isscc19947.2020.9062995
2020-02-01
Abstract:Advanced AI edge chips require multibit input (IN), weight (W), and output (OUT) for CNN multiply-and-accumulate (MAC) operations to achieve an inference accuracy that is sufficient for practical applications. Computing-in-memory (CIM) is an attractive approach to improve the energy efficiency $(\mathrm{EF}_{\mathrm{MAC}}]$ of MAC operations under a memory-wall constraint. Previous SRAM-CIM macros demonstrated a binary MAC [4], an in-array 8b W-merging with near-memory computing (NMC) using 6T SRAM cells (limited output precision) [5], a 7b1N-1 bW MAC using a 10T SRAM cell (large area) [3], an 4b1N-5bW MAC with a T8T SRAM cell [1], and 8b1N-1bW NMC with 8T SRAM (long MAC latency $(T_{\mathrm{AC}})$) [2]. However, previous works have not achieved high IN/W/OUT precision with fast $\mathrm{T}_{\mathrm{AC}}$ compact-area, high $\mathrm{EF}_{\mathrm{MAC}}$, and robust readout against process variation, due to (1) small sensing margin in word-wise multiple-bit MAC operations, (2) a tradeoff between read accuracy vs. area overhead under process variation, (3) limited $\mathrm{EF}_{\mathrm{MAC}}$ due to decoupling of software and hardware development.