Abstract:The elliptical ultrasonic assisted grinding (EUAG) method has been proved to be promising in machining of hard and brittle materials, e.g., sapphire and silicon. However, its potential has not been sufficiently developed because the processing mechanism has not been clearly explained. This paper focuses on the surface formation mechanism in EUAG of monocrystal sapphire by investigating the fractal behavior of ground surface. The EUAG experiments on monocrystal sapphire were performed on the constructed apparatus by installing an elliptical ultrasonic vibrator on a CNC surface grinder. For comparison, the conventional grinding (CG) experiments were also carried out on the same experimental apparatus without ultrasonic vibration. The ground surfaces obtained were analyzed by fractal method, and results show that: (1) the great improvement of the surface quality with lower surface roughness is achieved in EUAG compared with those in CG. Moreover, the fractal dimension of ground surface in EUAG is larger than that in CG. It is also found that the fractal dimension is more sensitive to surface defect compared with the surface roughness. (2) The fractal dimension changes differently comparing CG with EUAG as the depth of cut increases from 0.4 to 3.2 μm. From the variations of the fractal dimension with different depth of cut, it is found that there are two variation regions, i.e., steady region and deteriorated region both in EUAG and CG, but the depth of cut in steady-deteriorated transition point of EUAG is larger than that in CG, meaning that the EUAG can achieve a deeper ductile depth of cut. (3) In EUAG, elliptic motion trajectories of adjacent abrasive grains interact with each other, causing the lower side walls of grooves and more exquisite microstructures. Thus the higher surface fractal dimension in EUAG is obtained and a better surface quality is achieved. Therefore, the surface formation characteristics in EUAG of monocrystal sapphire can be investigated by fractal analysis.

Evaluation of Grinding Characteristics for Sapphire Ultra-Precision Grinding Using Small Grit Sizes Wheels Based on AE Signals

Monitoring of Ductile–brittle Transition Mechanisms in Sapphire Ultra-Precision Grinding Used Small Grit Size Grinding Wheel Through Force and Acoustic Emission Signals

Study on Subsurface Damage Behavior in Ductile Ultra-Precision Grinding of Sapphire Based on Acoustic Emission Signal Processing

Experimental Investigation of Correlation Between Attrition Wear and Features of Acoustic Emission Signals in Single-Grit Grinding

Surface and subsurface microscopic characteristics in sapphire ultra-precision grinding

Residual Stress and Subsurface Damage in Sapphire Ultra-Precision Grinding

Subsurface Damage in Sapphire Ultra-Precision Grinding

An Investigation of Monitoring the Damage Mechanism in Ultra-Precision Grinding of Monocrystalline Silicon Based on AE Signals Processing

An Investigation on Wear Mechanism of Resin-Bonded Diamond Wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

An Experimental Investigation of Sapphire Grinding by Porous and Vitrified M0.5/1.5 Diamond Grinding Wheel

Investigation of Diamond Wheel Topography in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire Using Fractal Analysis Method.

C13 Wear Characteristics of Grinding Wheel on Spiral Ultrasonic Assisted Grinding of Sapphire Wafer : Topographic Features of Vitrified Diamond Wheel

Evaluation of Crack Growth Stage of Sapphire under Scratching Based on AE Signals

Surface damage characteristics and identification based on acoustic emission in diamond point grinding carbon/carbon ceramic matrix composites

Investigation on surface formation mechanism in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire based on fractal analysis method

Piezoelectric Ultrasonic Local Resonant Ultra-Precision Grinding for Hard–Brittle Materials

2205 Grinding Performance of Spiral Ultrasonic Assisted Grinding for Monocrystal Sapphire Using Vitrified Diamond Wheel

Grinding Force Characteristics in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire

Research on Sapphire Surface Microstructure Processed by Diamond Grinding Wheel

E22 Fundamental Grinding Characteristics of Sapphire Wafer in Spiral Ultrasonic Vibration Assisted Grinding