Influence Mechanism of O 2 /H 2 O Adsorption on Cu(111) Surface on SF 6 Overheating Failure Decomposition

Fuping Zeng
DOI: https://doi.org/10.1007/s11090-022-10305-8
2022-01-01
Plasma Chemistry and Plasma Processing
Abstract:In gas-insulated equipment, the decomposition of SF 6 is closely related to the residual traces of O 2 and H 2 O in the equipment. However, the decomposition mechanism has not yet been clarified. In this paper, the adsorption and defluorination of SF 6 on the preadsorbed Cu(111) surface were calculated based on density flooding theory and transition state theory. Besides, the influence mechanism of O atoms and H 2 O molecules on the defluorination process is analyzed by comparing the energy barrier, reaction heat, and density of states. The results show that pre-adsorption of O atoms changes the adsorption sites of SF x , but has no significant effect on the adsorption energy. In addition, the O atom has a certain inhibitory effect on the decomposition process, and SF → S + F is the key to determining the reaction rate. In contrast, H 2 O will not only promote the adsorption of SF x to the surface but also reduce the total reaction heat of the decomposition reaction by 135.37 kcal·mol −1 , driving the decomposition process of SF 6 . In this paper, stable co-adsorption configurations of low-fluorosulfide and co-adsorption groups were determined, and the effects of O and H 2 O preadsorption on SF 6 /Cu gas–solid interactions were initially revealed.
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