Experimental and Numerical Investigation of Low Melting Point Alloy for Downhole Electronics at High Temperature

Chao Deng,Fulong Wei,Wei Lan,Jiale Peng,Xiaobing Luo
DOI: https://doi.org/10.1109/PEAC56338.2022.9959508
2022-01-01
Abstract:The logging tools are utilized to explore the underground petroleum resources, facing high temperature downhole environment above $200^{\circ}\mathrm{C}$. To protect internal electronics, passive thermal management system combined with low melting point alloy (LMPA) phase change materials and vacuum flask has been proposed and successfully used in logging tools. But there are a few types of alloys used for thermal management of logging tools. Besides, due to interaction between thermal physical properties, the alloy type cannot exactly be selected with best thermal performance in the stage of thermal design. To solve this issue, six different low melting point alloys are prepared and characterized firstly, and the finite element method is adopted to simulate the thermal performance of different alloys. It is showed that the prepared alloys display diverse temperature control performance versus time. Different thermal physical property plays a dominant role in different stages. LMPAI, LMPA2 and LMPA4 show the best performance within 1. 5h, from 1. 5h to 6h, and after 6h, respectively. Finally, LMPA4 is adopted to experimental verification, which possesses the best thermal performance than others at 8h. And good agreement between the simulation and experiment is reached with the average error of $2.6^{\circ}\mathrm{C}$ and the maximum relative error lower than 10%.
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