Abstract:In the semiconductor manufacturing industry, achieving high yields constitutes one of the pivotal factors for sustaining market competitiveness. When confronting the substantial volume of high-dimensional, non-linear, and imbalanced data generated during semiconductor manufacturing processes, it becomes imperative to transcend traditional approaches and incorporate machine learning methodologies. By employing non-linear classification models, one can achieve more real-time anomaly detection, subsequently facilitating a deeper analysis of the fundamental causes behind anomalies. Given the considerable dimensionality of production line data in semiconductor manufacturing, there arises a necessity for dimensionality reduction to mitigate noise and reduce computational costs within the data. Feature selection stands out as one of the primary methodologies for achieving data dimensionality reduction. Utilizing wrapper-based heuristics algorithms, although characterized by high time complexity, often yields favorable performance in specific cases. If further combined into hybrid methodologies, they can concurrently satisfy data quality and computational cost considerations. Accordingly, this study proposes a two-stage feature selection model. Initially, redundant features are eliminated using mutual information to reduce the feature space. Subsequently, a Simplified Swarm Optimization algorithm is employed to design a unique fitness function aimed at selecting the optimal feature subset from candidate features. Finally, support vector machines are utilized as the classification model for validation purposes. For practical cases, it is evident that the feature selection method proposed in this study achieves superior classification accuracy with fewer features in the context of wafer anomaly classification problems. Furthermore, its performance on public datasets further substantiates the effectiveness and generalization capability of the proposed approach.

Optimal Feature Subset Determination for High-Dimensional Datasets in Manufacturing Processes

Adaptive Principal Component Analysis Combined with Feature Extraction-Based Method for Feature Identification in Manufacturing

Invariant optimal feature selection: A distance discriminant and feature ranking based solution

Feature Selection for Data Classification in the Semiconductor Industry by a Hybrid of Simplified Swarm Optimization

An Optimal Feature Subset Selection Method Based On Distance Discriminant And Distribution Overlapping

Product Quality Improvement Method In Manufacturing Process Based On Kernel Optimisation Algorithm

A Feature Selection Method Based on Feature Grouping and Genetic Algorithm

Feature Group Optimization for Machinery Fault Diagnosis Based on Fuzzy Measures

Attribute Selection Algorithm of Data-Based Scheduling Strategy for Semiconductor Manufacturing.

Data-driven adaptive and stable feature selection method for large-scale industrial systems

A Hybrid Feature Selection Approach Based on ReliefF-FC-SS Algorithm for Multi-feature Data

High-Dimensional Feature Selection Based on Improved Binary Ant Colony Optimization Combined with Hybrid Rice Optimization Algorithm

A novel hybrid feature selection method based on dynamic feature importance

Big Data Analytics for Cycle Time Related Feature Selection in the Semiconductor Wafer Fabrication System

Size Adaptive Selection of Most Informative Features

Decision Variants for the Automatic Determination of Optimal Feature Subset in RF-RFE

High-dimensional Supervised Feature Selection Via Optimized Kernel Mutual Information

Unsupervised Feature Selection Algorithm Based on Dual Manifold Re-ranking

High-Performance Fault Classification Based on Feature Importance Ranking-XgBoost Approach with Feature Selection of Redundant Sensor Data

Robust Unsupervised Feature Selection Via Matrix Factorization

Feature Selection Approach Based on Improved Fuzzy C-Means with Principle of Refined Justifiable Granularity