Tightly Coupled Ultra-Wideband Phased-Array Implemented by Three-Dimensional Inkjet Printing Technique

Lei Han,Gang Wang,Lin Zhang,Weixu Jiang,Pengbing Zhao,Wei Tang,Tao Dang,Hongxing Zheng

DOI: https://doi.org/10.3390/electronics11203320

IF: 2.9

2022-01-01

Electronics

Abstract:In order to enhance the gains from antennas suitable for airplane-mounted platforms, a tightly coupled antenna array is investigated in this paper. Specifically, a three-dimensional (3-D) inkjet printing technique is used to implement the conformal characteristics needed for the array. Both the radiators and substrate of the antenna array have been fabricated by combining the fused deposition modeling and microdroplet injection molding technologies, based on an existing 3-D printer. Here, through a unique combination of 3-D and 2-D inkjet printing of dielectric material and metallic ink, respectively, we demonstrate a monolithically integrated design for a nonplanar antenna for the first time. The antenna measurements herein show the complete characterization of this new process in terms of minimum feature size and achievable conductivities. This antenna configuration offers a high-gain performance with a low-cost and rapid fabrication technique by using 3-D printing techniques. To check our design, the voltage standing wave ratio and radiation patterns were tested after adding the newly designed feed structure. The results show that the design process is very efficient. Both the antenna element and the array demonstrate positive properties and are in very good agreement with the specially mounted platform.