Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction
Wen Dai,Xing-Jie Ren,Qingwei Yan,Shengding Wang,Mingyang Yang,Le Lv,Junfeng Ying,Lu Chen,Peidi Tao,Liwen Sun,Chen Xue,Jinhong Yu,Chengyi Song,Kazuhito Nishimura,Nan Jiang,Cheng-Te Lin
DOI: https://doi.org/10.1007/s40820-022-00979-2
2022-12-11
Abstract:Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m −1 K −1 and contact thermal resistance as low as 4–6 K mm 2 W −1 (double sides). The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology