Electrodeposition of Nickel-Tungsten Alloy with Functional Concentration Periodically Graded Material Structure for Low Stress and High Hardness
Soobin Park,Haneul Han,jinmyeong Seo,Jungjoon Park,Sanghwa Yoon,Bongyoung Yoo
DOI: https://doi.org/10.1149/1945-7111/ad2394
IF: 3.9
2024-01-31
Journal of The Electrochemical Society
Abstract:The nickel-tungsten alloy film was deposited using electrodeposition process. The tungsten concentration in the nickel-tungsten alloy was controlled by changing the applied current density. The surface morphology, micro-structure, internal stress, and hardness were characterized as a single-layer structure. As the tungsten content increased, the hardness increased, but micro-cracks occurred on the surface. To increase the hardness without micro-cracks, a multi-layered structure was selected. The multi-layered nickel-tungsten alloy film was deposited in two types: functional periodic materials and functional graded materials. Both multi-layered structures were deposited by changing the applied current density periodically and gradually, respectively, during the deposition process. The mechanical properties, such as internal stress and hardness of the nickel-tungsten alloy, were characterized as a function of the tungsten concentration of the nickel-tungsten alloy film. As the number of periods increased, the internal stress decreased, and micro-cracks were removed on the surface. However, the gradually varied nickel-tungsten alloy had higher internal stress than the periodically varied alloy. Similar hardness was observed because the concentration of nickel-tungsten film at the top of the multi-layered structure was the same. The study demonstrated the enhancement of mechanical properties, including low internal stress and high hardness, of concentration periodically graded nickel-tungsten alloy.
electrochemistry,materials science, coatings & films