A Phenomenological Framework for Modeling of Nonlinear Mechanical Responses in Soft Network Materials with Arbitrarily Curved Microstructures

Shunze Cao,Jun Wu,Yuchen Lai,Zhangming Shen,Jianxing Liu,Renheng Bo,Jiahui Chang,Zhanyu Wang,Yihui Zhang

DOI: https://doi.org/10.1016/j.eml.2022.101795

IF: 4.728

2022-01-01

Extreme Mechanics Letters

Abstract:Soft network materials (SNMs), consisting of rationally designed filamentary microstructures distributed periodically in lattice patterns, offer high air permeability, excellent defect insensitivity and highly tunable mechanical properties that could match precisely those of biological tissues. Owing to these excellent physical properties, SNMs have been widely used in stretchable electronics, biomedical engineering, soft robotics, and other areas. Although a few theoretical models were developed previously to predict nonlinear J-shaped stress–strain curves of SNMs with horseshoe microstructures, these models are not applicable to SNMs with arbitrarily curved microstructures. Herein, we establish a phenomenological framework capable of predicting nonlinear mechanical responses of SNMs with arbitrarily curved microstructures and various lattice topologies. The phenomenological framework incorporates a two-segment model that exploits simple, explicit expressions to capture the J-shaped stress–strain relationship, and a machine learning (ML) approach that enables the determination of the single phenomenological parameter in the model. Both finite element analysis (FEA) and experimental measurements on a diversity of SNMs have been conducted to validate the phenomenological model. The developed model enables a rapid inverse design of biomimetic SNMs for reproducing the target J-shaped stress–strain curves of soft biological tissues, and can be also extended to model anisotropic mechanical responses of SNMs with horseshoe microstructures. The versatile applicability of the phenomenological framework suggests that it can serve as a reliable design tool of SNMs for uses in tissue engineering and bioelectronics.