Tackling the Coupled Thermal Stress and Heat at Small Scales

Zhan Haifei,Lü Chaofeng
DOI: https://doi.org/10.1007/s11433-022-1961-2
2022-01-01
Science China Physics Mechanics and Astronomy
Abstract:>Fast technological advancement has driven our society into an electronic era(Figure 1(a)). The ongoing miniaturization significantly increases the power density and heat flux density of electronics, e.g., in the order of 100 W/cm 2 for a server chip. For illustration, at a temperature difference of
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