Abstract:Chiplets integration offers a compelling value proposition for yield improvement, IP reuse, performance and cost optimization. Various advanced packaging technologies such as 2.5D Si TSV interposer, Fanout RDL organic interposer and 3D hybrid bonding have been deployed for chiplets and system heterogeneous integrations. Meanwhile, integrating multiple chiplets with diverse functions into a single package has also created a demand for advanced packages with higher density interconnects and larger footprint body sizes. How to optimize the layout to get the optimal performance among the chiplets has become very critical. In addition, high density and complex connectivity in advanced packaging cause more challenges by using traditional EDA tools for packaging design and assembly manufacturing validation. Furthermore, the die-to-die interconnects for chiplets integration are usually proprietary links from different customers, thus also create more design boundaries and limit the adoption of advanced packaging technology. In this paper, a new chip-to-package hybrid design platform for chiplets integration using advanced packaging technology was introduced. The design platform was utilized to complete the routings of ultra-high density I/O in 2.5D Si interposer and Fan-Out RDL organic interposer. Compared with the traditional package level design platform, the new hybrid design platform had reduced the design cycle time and improved design accuracy. Additionally, this platform had leveraged and validated the open standard Die-to-Die interconnects through the UCIe (Universal Chiplet Interconnect Express) ecosystem. Good electrical performance was achieved and met the requirements under the pin speed of 32Gbps for both fanout RDL organic interposer and 2.5D Si TSV advanced packaging technologies. Furthermore, a new packaging process design kit (PDK) had been developed to provide IC and system designers with advanced packaging design rules. Finally, this paper elaborated the design challenges and collaboration with system and IC design companies on chiplets integration from the perspective of OSATs.

Upward Packet Popup for Deadlock Freedom in Modular Chiplet-Based Systems

Design of Petri net-based deadlock prevention controllers for flexible manufacturing systems

Remote Control: A Simple Deadlock Avoidance Scheme for Modular System on Chip

Sequence Control of Essential Siphons for Deadlock Prevention in Petri Nets

A Scalable Deadlock-Free Static Routing Algorithm for Chiplet-Based Systems

PAIR: Periodically Alternate the Identity of Routers to Ensure Deadlock Freedom in NoC

A Scalable Methodology for Designing Efficient Interconnection Network of Chiplets

LBDR: A load-balanced deadlock-free routing strategy for chiplet systems

Efficient deadlock avoidance for 2D mesh NoCs that use OQ or VOQ routers

A Deflection-Based Deadlock Recovery Framework to Achieve High Throughput for Faulty NoCs

DeFT: A Deadlock-Free and Fault-Tolerant Routing Algorithm for 2.5D Chiplet Networks

The Column-Partition and Row-Partition Turn Model.

Pull-off Buffer: Borrowing Cache Space to Avoid Deadlock for Fault-Tolerant NoC Routing

Aggressive Fine-Grained Power Gating of NoC Buffers

Latency Criticality Aware On-Chip Communication

Experience on Applying Push Model to Packet Processors in High Performance Routers.

Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration

An Efficient and Low-Overhead Chip-to-Chip Interconnect Protocol Design for NOC

Deadlock Recovery Technique in Bus Enhanced NoC Architecture

Advanced Packaging Design Platform for Chiplets and Heterogeneous Integration

A global-aware bandwidth-constraint routing scheme for Network-on-Chip