Abstract:Abstract Large, 3D curved electronics are a trend of the microelectronic industry due to their unique ability to conformally coexist with complex surfaces while retaining the electronic functions of 2D planar integrated circuit technologies. However, these curved electronics present great challenges to the fabrication processes. Here, we propose a reconfigurable, mask-free, conformal fabrication strategy with a robot-like system, called robotized ‘transfer-and-jet’ printing, to assemble diverse electronic devices on complex surfaces. This novel method is a ground-breaking advance with the unique capability to integrate rigid chips, flexible electronics, and conformal circuits on complex surfaces. Critically, each process, including transfer printing, inkjet printing, and plasma treating, are mask-free, digitalized, and programmable. The robotization techniques, including measurement, surface reconstruction and localization, and path programming, break through the fundamental constraints of 2D planar microfabrication in the context of geometric shape and size. The transfer printing begins with the laser lift-off of rigid chips or flexible electronics from donor substrates, which are then transferred onto a curved surface via a dexterous robotic palm. Then the robotic electrohydrodynamic printing directly writes submicrometer structures on the curved surface. Their permutation and combination allow versatile conformal microfabrication. Finally, robotized hybrid printing is utilized to successfully fabricate a conformal heater and antenna on a spherical surface and a flexible smart sensing skin on a winged model, where the curved circuit, flexible capacitive and piezoelectric sensor arrays, and rigid digital–analog conversion chips are assembled. Robotized hybrid printing is an innovative printing technology, enabling additive, noncontact and digital microfabrication for 3D curved electronics.

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