Reduction of the Water Wettability of Cu Films Deposited on Liquid Surfaces by Thermal Evaporation

Ziran Ye,Meinan Lou,Xiqian Jia,Jiawei Shen,Ping Lu,Haixia Huang,Gaoxiang Ye,Bo Yan
DOI: https://doi.org/10.1016/j.colsurfa.2022.129569
2022-01-01
Abstract:We report a facile approach for the wettability control of copper (Cu) films grown on a silicone oil surface by thermal evaporation. Characteristic aggregation of deposited Cu atoms was obtained due to the isotropic and free-sustained liquid substrates. Through the fine adjustment of deposition parameters in the growth process, Cu films with controlled morphology from ramified aggregates to continuous films can be prepared. Accompanied with the evolution of morphology, water wettability was effectively reduced and the hydrophilic-to-hydrophobic transition can be achieved. The relationship between the wettability and microstructure of Cu films was investigated. These films with characteristic morphology and controlled wettability may open lots of application avenues in the development of devices with modified surface properties.
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