Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
P. Wang,B.L. Wang,K.F. Wang,H. Hirakata,C. Zhang
DOI: https://doi.org/10.1016/j.ijengsci.2019.06.005
IF: 7.155
2019-01-01
International Journal of Engineering Science
Abstract:Thermoelectric (TE) materials as energy functional semiconductors can directly convert heat into electrical power. Due to the brittle nature of semiconductors, voids or inclusions are easy to be produced in the TE materials. This paper studies the three-dimensional ellipsoidal inclusion problem in thermoelectric materials. By introducing two auxiliary functions, we successfully simplify the non-linear coupled governing equations into linear un-coupled equations and the linearization is validated by two practical cases. Based on the Green's function method, the analytical solutions of this problem are derived. We find that the thermoelectric field inside the ellipsoidal inclusion is always uniform when subjected to far-field uniform loads. Furthermore, we derive the effective material properties of the matrix-inclusion system in closed-form. We find that it is possible to enhance the thermoelectric properties as well as the figure of merit by inserting specific inclusions. Moreover, among the different shapes of inclusions, the elliptical cylinder fiber that lies along the loading direction has the most significant improvements to the material properties. This paper is the first that derives the analytical solutions of three-dimensional inclusion problems in TE materials.