Preparation of Graphene/copper Composites with a Thiophenol Molecular Junction for Thermal Conduction Application

Xiaofang Li,Jianwen Miu,Meng An,Jing Mei,Fenghua Zheng,Juantao Jiang,Hongqiang Wang,Youguo Huang,Qingyu Li

DOI: https://doi.org/10.1039/d2nj00374k

IF: 3.3

2022-01-01

New Journal of Chemistry

Abstract:An electron thermal conduction route is constructed between graphene and Cu using a thiophenol molecular junction.

What problem does this paper attempt to address?

Preparation of graphene/copper composite with thiophenol molecular junction for thermal conductive application

Xiaofang Li,Jianwen Miu,Meng An,Jing Mei,Fenghua Zheng,Juantao Jiang,Hongqiang Wang,Youguo Huang,Qingyu Li,meng an,jing mei

DOI: https://doi.org/10.1039/d2nj00374k

IF: 3.3

2022-01-01

New Journal of Chemistry

Abstract:Elimination of interfacial thermal resistance is the critical issue to improve the thermal conductivity of graphene-based metal matrix composite. Here, thiophenol groups were employed to construct an interfacial molecular junction...

chemistry, multidisciplinary
New construction of electron thermal conductive route for high-efficient heat dissipation of graphene/Cu composite

Xiaofang Li,Chunlei Tan,Juantao Jiang,Shaoyi Wang,Fenghua Zheng,Xiaohui Zhang,Hongqiang Wang,Youguo Huang,Qingyu Li

DOI: https://doi.org/10.1016/j.carbon.2021.01.157

IF: 10.9

2021-06-01

Carbon

Abstract:High-efficient heat dissipation is essential to maintain the best performance of the electron devices. A new electron thermal conductive route is first proposed and constructed for the graphene metal matrix composites in this work. Functionalization of graphene with conjugated 4-ethynylaniline (FGr) and deposition of FGr and Cu2+ ions onto the copper surface by pulsed-current co-electrodeposition are successively employed to prepare the FGr/Cu composite. The resulting thermal diffusivity of FGr/Cu is high as 1.444 cm2 s-1 at 100 °C, which is corresponding to the thermal conductivity of 497 W m-1 K-1 and higher than the reported values via single phonon thermal conductive route. FGr/Cu can maintain a superior and stable thermal conductive property at high temperature with a multiple of 1.61 and 1.31 at 100 °C and 150 °C compared to the Cu, respectively. The delocalized conjugated π bond in the graphene/Cu interface is successfully established through the bridging of graphene and metal with conjugated organic molecule possessing p orbits, which leads to the construction of a new electron thermal conductive route. This innovation presents an entirely new direction to develop graphene-based metal matrix composite with high-efficient heat dissipation.

materials science, multidisciplinary,chemistry, physical
Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

Xiaofang Li,Meng An,Peide Li,Jianwen Miu,Qiang Wu,Fenghua Zheng,Juantao Jiang,Hongqiang Wang,Youguo Huang,Qingyu Li

DOI: https://doi.org/10.1021/acsanm.1c02680

IF: 6.14

2021-10-28

ACS Applied Nano Materials

Abstract:Developing highly efficient thermal management techniques is crucial in order to achieve the best performance of electronic equipment. Here, a delocalized conjugated system was established by the conjugation of sp2 orbitals in phenylamine groups and a delocalized big π bond in graphene to construct an electron thermal conduction route. Then, the abundant π electrons in graphene can be transferred to the adjacent copper unimpededly, leading to a remarkable thermal conductivity. These results demonstrate that the copper substrate deposited with phenylamine-functionalized graphene (PA–Gr–Cu) shows a high thermal conductivity of 506 W m–1 k–1, which is 30.8 and 44.2% higher than those of the pristine graphene–copper composite (Gr–Cu) and copper (Cu), respectively. Placed on a heat source heated from 30 to 210 °C within 5 min, the top surface temperature of PA–Gr–Cu increases to 198 °C rapidly, whereas those of Gr–Cu and Cu only increase gently to 88 and 59 °C. This work demonstrates that phenylamine with a pair of lone electrons in the N atom shows superiority as an intermediate molecule to link graphene and copper to establish a delocalized conjugated system. This innovation provides another solution to establish a conjugated structure between graphene and copper to construct an electron thermal conduction route with remarkable thermal conduction properties and will promote the research on the electron thermal conduction route for graphene-based metal matrix composites in the application of thermal dissipation.

materials science, multidisciplinary,nanoscience & nanotechnology
Preparation of Functionalized Graphene/thermal Conductive Polyurethane Films

Zuhuo Luo,Jie Yan,Danqing Chen

DOI: https://doi.org/10.1088/1742-6596/1759/1/012020

2021-01-01

Journal of Physics Conference Series

Abstract:Abstract Graphene/polymer composites have been widely used as thermal conductive materials in electronic equipment. However, the development of advanced graphene thermal conductive composites faces many problems, such as easy agglomeration, high interfacial thermal resistance and poor mechanical properties. In our work, new graphene-based polyurethane thermal conductive composites based on octadecylamine (ODA), graphene and thermoplastic polyurethane were prepared. The thermal conductivity(λ) of the composites reached 1.46W/(mK) with loading 20wt.%mRGO, which was increased by 326.02% compared with that of TPU.
Aromatic molecular junctions between graphene sheets: a molecular dynamics screening for enhanced thermal conductance

Alessandro Di Pierro,Maria Mar Bernal,Diego Martinez,Bohayra Mortazavi,Guido Saracco,Alberto Fina

DOI: https://doi.org/10.1039/c9ra00894b

2019-10-30

Abstract:The proper design and synthesis of molecular junctions for the purpose of establishing percolative networks of conductive nanoparticles represent an opportunity to develop more efficient thermally-conductive nanocomposites, with several potential applications in heat management. In this work, theoretical classical molecular dynamics simulations were conducted to design and evaluate thermal conductance of various molecules serving as thermal bridges between graphene nanosheets. A wide range of molecular junctions was studied, with a focus on the chemical structures that are viable to synthesize at laboratory scale. Thermal conductances were correlated with the length and mechanical stiffness of the chemical junctions. The simulated tensile deformation of the molecular junction revealed that the mechanical response is very sensitive to small differences in the chemical structure. The analysis of the vibrational density of states provided insights into the interfacial vibrational properties. A knowledgedriven design of the molecular junction structures is proposed, aiming at controlling interfacial thermal transport in nanomaterials. This approach may allow for the design of more efficient heat management in nanodevices, including flexible heat spreaders, bulk heat exchangers and heat storage devices.

Applied Physics,Materials Science
Preparation and Characterization of Electroplated Cu/Graphene Composite

Xin Wang,Qian Wang,Jian Cai,Changming Song,Yang Hu,Yang Zhao,Yu Pei

DOI: https://doi.org/10.1109/ECTC.2019.00-12

2019-01-01

Abstract:Cu and unoxidized graphene composite films were prepared by electroplating under room temperature. Graphene was added to the electrolyte of Cu to form composite materials to improve the performance of Cu for interconnection. Composite electrolyte containing high concentration of graphene (up to 0.5 g/L) was prepared by adding CTAB as surfactant. And ultrasound was also used to increase dispersion degree and reduce graphene agglomeration in electrolyte. Average coefficient of thermal expansion (CTE) of the composite films determined by thermo-mechanical analysis (TMA) shows a decrease from 17.3 ppm/K to 14.2 ppm/K from 260 K to 320 K, which reduce CTE by 18 % compared with Cu. CTE of the composite materials can be reduced to 10 ppm/K at 243 K, which is only 60 % of CTE of Cu. The thermal conductivity of the composite materials measured by phase sensitive transient thermo-reflectance (PSTTR) technique shows an improvement from 385 W/m.K to 468 W/m.K. CTE and thermal conductivity of the composite materials both decrease with the increase of current density. And they also both increase with the increase of graphene concentration. The composite materials also show good mechanical properties. The average hardness is 2.5 GPa, which is about 2 times of Cu. And the average elastic modulus is 145 GPa, which is 38 % higher than that of Cu. The resistivity of the composite materials is basically equivalent to that of pure Cu. Result of the experiment proved that the composite materials have better performance under low temperature conditions. The improvement of material properties makes composite materials have good application prospects for 3D interconnection in the near future.
Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design

Ke Zhan,Fengjia Li,Weizhen Wang,Yan Xu,Rui Zhao,Zheng Yang,Zhuo Wang,Bin Zhao

DOI: https://doi.org/10.1016/j.jallcom.2022.164085

IF: 6.2

2022-05-01

Journal of Alloys and Compounds

Abstract:Cu/graphene oxide(GO)/Cu laminated composite foils possessed with simultaneously high thermal and mechanical properties were prepared by a novel fabricating method, including electro-deposition, ultrasonic spraying and vacuum hot-press sintering (VHP) processing. The effect of processing parameters and laminated construction on its microstructure, morphology and properties were studied. The results showed that the C-O-Cu covalent bonding was formed at the interface between electro-deposited layers of copper and ultrasonic sprayed GO films during the fabrication process. Under the optimum process parameters, the in-plane thermal conductivity of the composites reached up to 416.7 W·m-1·k-1, meanwhile, the tensile strength of the composites was 295.1 MPa with an elongation of 20.7%, which were increased by 24.4%, comparing with pure Cu foils. The strong graphene/copper interface bonding and laminated structure were responsible for the simultaneously enhanced thermal and mechanical properties.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Thermal bridging of graphene nanosheets via covalent molecular junctions: A non-equilibrium Green’s functions–density functional tight-binding study

Diego Martinez Gutierrez,Alessandro Di Pierro,Alessandro Pecchia,Leonardo Medrano Sandonas,Rafael Gutierrez,Mar Bernal,Bohayra Mortazavi,Gianaurelio Cuniberti,Guido Saracco,Alberto Fina

DOI: https://doi.org/10.1007/s12274-019-2290-2

IF: 9.9

2019-02-25

Nano Research

Abstract:Despite the uniquely high thermal conductivity of graphene is well known, the exploitation of graphene into thermally conductive nanomaterials and devices is limited by the inefficiency of thermal contacts between the individual nanosheets. A fascinating yet experimentally challenging route to enhance thermal conductance at contacts between graphene nanosheets is through molecular junctions, allowing covalently connecting nanosheets, otherwise interacting only via weak Van der Waals forces. Beside the bare existence of covalent connections, the choice of molecular structures to be used as thermal junctions should be guided by their vibrational properties, in terms of phonon transfer through the molecular junction. In this paper, density functional tight-binding combined with Green’s functions formalism was applied for the calculation of thermal conductance and phonon spectra of several different aliphatic and aromatic molecular junctions between graphene nanosheets. Effects of molecular junction length, conformation, and aromaticity were studied in detail and correlated with phonon tunnelling spectra. The theoretical insight provided by this work can guide future experimental studies to select suitable molecular junctions, in order to enhance the thermal transport by suppressing the interfacial thermal resistances. This is attractive for various systems, including graphene nanopapers and graphene polymer nanocomposites, as well as related devices. In a broader view, the possibility to design molecular junctions to control phonon transport currently appears as an efficient way to produce phononic devices and controlling heat management in nanostructures.

materials science, multidisciplinary,chemistry, physical,physics, applied,nanoscience & nanotechnology
Preparation and Thermal Properties of the Graphene-Polyolefin Adhesive Composites: Application in Thermal Interface Materials

Tengfei Cui,Qiang Li,Yimin Xuan,Ping Zhang

DOI: https://doi.org/10.1016/j.microrel.2015.07.036

IF: 1.6

2015-01-01

Microelectronics Reliability

Abstract:Graphene mixed with epoxy for thermal interface material (TIM) has been well researched. However, some issues emerge when epoxy is used as matrix material, such as overflow problem, non-uniform thickness, needing solidification time, etc. In order to avoid the above issues, a new high performance phase change material (PCM) is prepared by incorporating graphene with polyolefin hot melt pressure sensitive adhesive (HMPSA). The thermal conductivity and hardness of graphene/HMPSA (GHMPSA) composites are both measured and found to be increased with the increase of filled graphene. Due to the increasing hardness, the smallest thermal contact resistance is achieved with 6wt.% graphene, not 10wt.%, even the biggest thermal conductivity of GHMPSA is 5.6W/(mK) with 10wt.% graphene. The comparison between the present GHMPSA TIM and other commercial TIMs indicates that the present GHMPSA composite is a commendable TIM in reducing thermal contact resistance.
Conductive Junctions with Parallel Graphene Sheets

Xiao Zheng,San-Huang Ke,Weitao Yang

DOI: https://doi.org/10.1063/1.3357416

2010-01-01

Abstract:The establishment of conductive graphene-molecule-graphene junction is investigated through first-principles electronic structure calculations and quantum transport calculations. The junction consists of a conjugated molecule connecting two parallel graphene sheets. The effects of molecular electronic states, structure relaxation, and molecule-graphene contact on the conductance of the junction are explored. A conductance as large as 0.38 conductance quantum is found achievable with an appropriately oriented dithiophene bridge. This work elucidates the designing principles of promising nanoelectronic devices based on conductive graphene-molecule-graphene junctions.
Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Rui Zhao,Weikai Li,Tian Wang,Ke Zhan,Zheng Yang,Ya Yan,Bin Zhao,Junhe Yang

DOI: https://doi.org/10.1007/s11706-020-0503-y

2020-05-15

Frontiers of Materials Science

Abstract:Effective thermal management of electronic integrated devices with high powder density has become a serious issue, which requires materials with high thermal conductivity (TC). In order to solve the problem of weak bonding between graphite and Cu, a novel Cu/graphite film/Cu sandwich composite (Cu/GF/Cu composite) with ultrahigh TC was fabricated by electro-deposition. The micro-riveting structure was introduced to enhance the bonding strength between graphite film and deposited Cu layers by preparing a rectangular array of micro-holes on the graphite film before electro-deposition. TC and mechanical properties of the composites with different graphite volume fractions and current densities were investigated. The results showed that the TC enhancement generated by the micro-riveting structure for Cu/GF/Cu composites at low graphite content was more effective than that at high graphite content, and the strong texture orientation of deposited Cu resulted in high TC. Under the optimizing preparing condition, the highest in-plane TC reached 824.3 W·m−1K−1, while the ultimate tensile strength of this composite was about four times higher than that of the graphite film.

materials science, multidisciplinary
Copper nanoparticle-deposited graphite sheets for highly thermally conductive polymer composites with reduced interfacial thermal resistance

Fei Xu,Di Bao,Yexiang Cui,Yueyang Gao,Dan Lin,Xiao Wang,Jianwen Peng,Haolei Geng,Huaiyuan Wang

DOI: https://doi.org/10.1007/s42114-021-00367-1

IF: 11.806

2021-10-26

Advanced Composites and Hybrid Materials

Abstract:Highly thermally conductive polymer-based composites are becoming increasingly important for effectively removing the accumulated heat of thermal management devices. However, interfacial thermal resistance (ITR) seriously affects the heat transfer performance of composites. Herein, after mildly modifying the commercial graphite, copper nanoparticles (CuNPs) are deposited on the surface of modified graphite (MGr) by chemically reducing. And the CuNPs-deposited MGr (MGr/Cu) hybrids are mixed with epoxy resin to prepare composites. Through the improved interfacial contact and interconnection between CuNPs and MGr, the heat conduction pathways will be easy to form in epoxy matrix. And the MGr/Cu hybrids exhibit well compatibility with epoxy matrix. Consequently, the resultant composite exhibits a high thermal conductivity of 4.57 W m−1 K−1 at 50 wt% MGr/Cu loading. Fitting the experimental value with Foygel nonlinear model further reveals that the ITR is 3.92 × 10−6 m2 K W−1 for MGr/Cu/epoxy composites, which decreases by 27.94% than that of Gr/epoxy composites. Moreover, our composite displays well heat dissipation potential in thermal management application. This strategy provides an effective guidance for reducing the ITR inside polymer composites to prepare thermal management materials.Graphic AbstractThe thermal conductivity is improved via thermally conductive Cu bridges between modified graphite and the improved compatibility between graphite and epoxy.

nanoscience & nanotechnology,materials science, composites
Study on the structure and thermal properties of graphite/copper laminated composites assembled by Ti-containing active filler metals

Weibing Guo,Yiren Hu,Tao Wang,Xiaoguang Chen

DOI: https://doi.org/10.1016/j.diamond.2023.110657

IF: 3.806

2023-11-27

Diamond and Related Materials

Abstract:The development of high-power and small-sized electronic components requires the emergence of heat management materials with high heat flux. Hence, Ti-containing filler was used to braze graphite film/Cu high heat flux composites. The microstructure and forming mechanism of joints were studied, the influence of temperature on joint formation was analyzed, and the influence of graphite volume fraction on the thermal properties of the composites were discussed. The results show that the main microstructure of graphite/copper joints are Cu(s,s), Ti 6 Sn 5 and CuTi 2 . As the brazing temperature increases, the carbide layer (TiC) that affects the connection gradually thickens, from <0.5 μm at 800 °C to 3 μm at 850 °C, which deeply improve heat transfer of composite materials. The tensile properties of composites also increase with increasing temperature, maximum tensile strength 31.94 MPa can be obtained at 850 °C. Furthermore, the composites are proved to possess high heat flux during process of heat transfer, and the transfer rate was 1.77 times that of Cu, 3.72 times of Al. The temperature rise test carry out in hot bench intuitively demonstrating that the composites have faster heating rate. Al used 197 s to raise from 25 °C to 50.5 °C, Cu used 140 s, while 76.92 % graphite-contained composites only took 75 s in the same volume and experimental condition.

materials science, multidisciplinary,physics, applied, condensed matter, coatings & films
Finite Element Simulation of Graphene Thermal Conductivity Framework

Jun Yang,J. Xiao,X. Wu

DOI: https://doi.org/10.1051/matecconf/202235801065

2022-05-20

MATEC Web of Conferences

Abstract:With the rapid development of electronic devices towards miniaturization and high integration, the problem of overheating and heat dissipation forces people to find thermal conductive materials with good comprehensive properties to meet the needs of development. Inspired by the three-dimensional boron nitride network, this paper creatively proposed the construction of a composite thermal conductive material with 3D graphene network structure and PDMS as filling matrix, and carried out finite element analysis and simulation with COMSOL. The results show that the thermal conductivity of the composite thermal conductive material with graphene 3D network structure is significantly better than that of the single thermal conductive material without graphene and the thermal conductive material with random distribution of graphene, and most of the heat flow forms a connected thermal conductive path along the heat transfer direction in the graphene of 3D network composite. It can be seen that the prepared composites with 3D thermal conduction network structure have excellent thermal conductivity, and will have broad market prospects in the fields of heat dissipation materials, computers, smart phones, laser weapons and so on.
Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

Dingkong Liu,Jinxing Zhao,Yueyang Ning,Hongbing Ma,Bo Wang,Yunxiang Lu,Wei Li,Linhong Li,Wen Dai,Cheng-Te Lin,Nan Jiang,Chen Xue,Jinhong Yu

DOI: https://doi.org/10.1016/j.coco.2021.100704

IF: 8

2021-06-01

Composites Communications

Abstract:Heat sink materials with superior thermal conductivity and excellent mechanical strength with low cost, are desirable for electronic packaging and thermal management in electronic and electrical engineering systems. In this work, the graphene paper (GP)/copper (Cu) composites were prepared by using a vacuum hot pressing. A zebra skin structure was constructed for improving the thermal transportation performance of GP/Cu composites. In virtue to its unique zebra skin structure, the ultrahigh thermal conductivity of 968 W m-1 K-1 was achieved for the GP/Cu composite at 70 vol% graphene loading. Furthermore, the GP/Cu composite retains high flexural strength (88 MPa) due to the good interface compatibility between the surface chemical treated GP and Cu paper. Our work provides a new method to significantly improve the in-plane thermal conductivity of thermal management materials.

materials science, composites
Thermal Analysis of Cu-Organic Composite Nanoparticles and Fabrication of Highly Conductive Copper Films

Yujie Li,Yao Huo,Changguang Li,Songling Xing,Lei Liu,Guisheng Zou

DOI: https://doi.org/10.1016/j.jallcom.2015.07.248

IF: 6.2

2015-01-01

Journal of Alloys and Compounds

Abstract:Interconnection structures made by Cu nanoparticles capped and stabilized by organics always have to be sintered to improve their electrical properties. To formulate a proper sintering process one has to be well aware of how the capping agent and the copper cores change with temperature. In this work, Cu nanoparticles capped by poly( vinylpyrrolidone) and sodium dodecyl sulfate have been synthesized and made into conductive thin films. Thermal analyses show that the Cu-organic composite nanoparticles are first oxidized at temperatures lower than 250 degrees C and then reduced in the temperature range of 300-420 degrees C by the organics and their decomposition products in Ar. The kinetic parameters of the reduction reaction have been determined. A sintering temperature of at least 450 degrees C is found to be necessary for complete decomposition of the organics and removal of the oxides. The effects of the sintering time, the heating rates, as well as the concentration of organics, on the microstructures and the electrical properties of the sintered films are also studied. The organic concentration in the films before sintering has to be carefully controlled in order to improve the electrical property of the copper films. By using an optimized preparing and sintering process, a film resistivity smaller than 1 x 10(-7) Omega m has been achieved. (C) 2015 Elsevier B.V. All rights reserved.
Fabrication of graphite/Cu composite foils with ultrahigh thermal conductivity by adding an intermediate nickel layer and vacuum hot pressing treatment

Ke Zhan,Rui Zhao,Fengjia Li,Tian Wang,Weikang Mo,Zheng Yang,Bin Zhao

DOI: https://doi.org/10.1016/j.jallcom.2021.161228

IF: 6.2

2021-12-01

Journal of Alloys and Compounds

Abstract:Copper/nickel coated graphite film/copper sandwich composite foils were fabricated by electro-deposition and subsequent vacuum hot pressing treatment. Intermediate nickel layers with different volume faction (5%, 10%, 15%, and 20%), which was calculated corresponds to the proportion between graphite film and Ni coating, were introduced to modify the interfacial bonding between graphite film and deposited copper. The effect of the vacuum hot pressing (VHP) parameters on the in-plane thermal conductivity (TC) was investigated systemically. The results showed that the existence of intermediate nickel layer could improve the interfacial bonding between graphite and copper, thus enhance the thermal conductivity of the fabricated composite foils. The maximum TC value of the composite foil (graphite volume fraction of 50 vol% with 10 vol% intermediate nickel layers) reached up to 1042.4 W m−1 K−1 after VHP treatment at the optimal process parameters (800 ℃, 60 min and 40 MPa). These composites possess higher in-plane thermal conductivities than graphite flake/copper composites due to well-controlled graphite/copper interfacial bonding and fabrication parameters.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
Graphene Interlayer for Enhanced Interface Thermal Conductance in Metal Matrix Composites: an Approach Beyond Surface Metallization and Matrix Alloying

Huaijie Cao,Zhanqiu Tan,Ming-Hui Lu,Gang Ji,Xue-Jun Yan,Chen Di,Mengying Yuan,Qiang Guo,Yishi Su,Ahmed Addad,Zhiqiang Li,Ding-Bang Xiong

DOI: https://doi.org/10.1016/j.carbon.2019.05.004

2019-01-01

Abstract:Poor wettability and acoustic mismatch between diamond and copper cause low interface thermal conductance and thus low thermal conductivity in their composites. In this work, beyond widely used strategies such as surface metallization and matrix alloying, in-situ grown graphene is introduced as a highly effective interlayer. The positive role of graphene on improving wetting between diamond and copper was supported by the increase of relative density, fractured surface morphology and interface microstructure. Thanks to the improved wetting and mitigated acoustic mismatch between diamond and copper, the interfacial thermal conductance is increased by ∼3.7 times in the diamond/graphene/copper composite as indicated by differential effective medium calculation. Such a positive role of graphene interlayer also agrees with the results from the time-domain thermoreflectance measurements. As a result, the thermal conductivity of the diamond/graphene/copper composite is 61% higher than that of the counterpart without graphene interlayer. This study provides a new approach for interface modification by 2D materials for a high TC of diamond/copper composite beyond surface metallization and matrix alloying.
Copper and Graphene Composite Material Prepared by Electrodeposition and Its Potential Application for 3D Integration

Xin Wang,Qian Wang,Yang Hu,Lin Tan,Jian Cai

DOI: https://doi.org/10.1109/icept.2017.8046757

2017-01-01

Abstract:Cu is commonly used as filling material for TSV in 3D integration [1]. However, there is a problem of thermal mismatch between Cu and Si, and also there is still space for improvement in electrical resistivity. In order to improve the physical properties of TSV electroplating copper, we added high conductivity and low expansion coefficient nanoparticles such as graphene to the copper plating solution. Composite electrodeposition is a convenient method of nano-powders composite coating, so we adopt the method of composite electrodeposition for copper and graphene composite materials. Copper and graphene composite electrodeposition has not been researched particularly. In this paper, we discuss a composite electrodeposition method of copper and graphene and evaluate the physical properties of the composite coatings. Firstly does the graphene dispersion, and under the condition we research the feasibility of copper and graphene composite electrodeposition. And graphene composite samples are obtained. Secondly we test the growth rate and electrical characteristics, and get the growth rate curve and the resistivity of composite material, and compare the result with pure copper material. The result shows that copper and graphene composite electrodeposition is feasible, and the electrical properties of composite samples is a little better than pure copper material sample. It has proved that it has a good application prospect in electrical performance.
Enhanced the thermal conductivity of flexible copper foil by introducing graphene

Jiao Li,Ping Zhang,Hong He,Bo Shi

DOI: https://doi.org/10.1016/j.matdes.2019.108373

2020-02-01

Abstract:Owing to the miniaturization, portability and wearable of electronic devices, the demand for advanced thermal management materials has increased significantly, especially for highly thermally conductive materials. In this paper, a simple and effective strategy for synthesizing high thermal conductivity copper-graphene (Cu-rGO) was proposed. The microstructure, thermal properties and thermal management capabilities of the composite film were studied. It was found that the obtained Cu-rGO film exhibits excellent flexibility and high thermal conductivity (637.7 W m−1 K−1). It indicates that the introduction of graphene effectively enhances the thermal conductivity of Cu matrix. Besides, the experimental results show that the Cu-rGO film has a lower coefficient of thermal expansion (CTE) and excellent heat transfer properties. This work provides important guidance for the preparation of high thermal conductivity composites that meet the growing heat dissipation requirements in the future.

materials science, multidisciplinary

Preparation of Graphene/copper Composites with a Thiophenol Molecular Junction for Thermal Conduction Application

Preparation of graphene/copper composite with thiophenol molecular junction for thermal conductive application

New construction of electron thermal conductive route for high-efficient heat dissipation of graphene/Cu composite

Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

Preparation of Functionalized Graphene/thermal Conductive Polyurethane Films

Aromatic molecular junctions between graphene sheets: a molecular dynamics screening for enhanced thermal conductance

Preparation and Characterization of Electroplated Cu/Graphene Composite

Preparation and mechanism of Cu/GO/Cu laminated composite foils with improved thermal conductivity and mechanical property by architectural design

Thermal bridging of graphene nanosheets via covalent molecular junctions: A non-equilibrium Green’s functions–density functional tight-binding study

Preparation and Thermal Properties of the Graphene-Polyolefin Adhesive Composites: Application in Thermal Interface Materials

Conductive Junctions with Parallel Graphene Sheets

Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Copper nanoparticle-deposited graphite sheets for highly thermally conductive polymer composites with reduced interfacial thermal resistance

Study on the structure and thermal properties of graphite/copper laminated composites assembled by Ti-containing active filler metals

Finite Element Simulation of Graphene Thermal Conductivity Framework

Constructing zebra skin structured graphene/copper composites with ultrahigh thermal conductivity

Thermal Analysis of Cu-Organic Composite Nanoparticles and Fabrication of Highly Conductive Copper Films

Fabrication of graphite/Cu composite foils with ultrahigh thermal conductivity by adding an intermediate nickel layer and vacuum hot pressing treatment

Graphene Interlayer for Enhanced Interface Thermal Conductance in Metal Matrix Composites: an Approach Beyond Surface Metallization and Matrix Alloying

Copper and Graphene Composite Material Prepared by Electrodeposition and Its Potential Application for 3D Integration

Enhanced the thermal conductivity of flexible copper foil by introducing graphene