Dynamic Interaction Between Complex Defect and Crack in Functionally Graded Magnetic-Electro-elastic Bi-Materials

Ni An,Tian-shu Song,Gangling Hou
DOI: https://doi.org/10.1080/15376494.2022.2062631
2022-01-01
Mechanics of Advanced Materials and Structures
Abstract:This paper aims to develop an effective theoretical method for analyzing the interaction of interfacial crack and complex defect in functionally graded magnetic-electro-elastic bi-materials with exponential variation under the action of anti-plane incident SH-wave. The boundary value problem of interest is solved by Green's function method. The mechanical model of the cracks is constructed through interface conjunction and crack deviation techniques, thereby simplifying the crack problem to solving a series of the first kind of Fredholm's integral equations, from which the dynamic stress intensity factor (DSIF) at the crack tips of the left crack are expressed. The validity of the present method is verified by comparing with a single crack model in previous work. Through the analyses of numerical cases, it can be concluded that the DSIF is related with 3 factors:the geometry of complex defect and crack, the characteristics of incident wave and the inhomogeneity of materials. Comparing with dual integral equations in dealing with asymmetric defects, the method in this paper is relatively more flexible and applicable, also it comes up with a new way to study fracture problems in functionally graded magnetic-electro-elastic materials with more complex defects.
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