Abstract:Adhesive interactions between soft materials are prevalent in both biological systems and various engineering applications, including soft robots, flexible electronics, and antifouling coatings. Many studies have demonstrated that cavitation and fingering instabilities emerge at the adhesive interface between rigid objects and soft films, owing to the geometric attributes of the contact region. However, in the context of peeling configurations, defining the geometric features is challenging, resulting in relatively scant exploration of interfacial instabilities. Hence, the modulation of instability patterns during the peeling process of a flexible plate from a thin elastic film, alongside the consequential effects on mechanical responses, remains poorly understood. To elucidate the mechanisms underlying interfacial instability during peeling process and its impacts on peel-off force, we use finite element methods to simulate the evolution of interface separation. Consistent with previous experimental observations, we find that the interfacial instability will occur when the bending stiffness of the flexible plate is bigger than a critical value. We show that the interfacial instability is mainly induced by the competition between the adhesion energy and the strain energy of the film, and the incompressibility of the thin film is critical for the appearance of the interfacial instability. Combining theory and finite element simulation, we propose the scaling laws for the critical peel-off force for stable and unstable peelings, respectively, and show that the critical peel-off force will decrease when the interfacial instability occurs. Finally, we demonstrate that weakening the tangential adhesion strength and loosening the constraints between the film and the rigid substrate effectively suppress fingering instability. Collectively, our findings elucidate the pivotal factors influencing interfacial instability, offering invaluable insights for the design of structures or systems involving soft materials.

Interfacial Competitive Debonding of a Bilayer Elastic Film on a Rigid Substrate

Debonding Characterization of Stiff Film/compliant Substrate Systems Based on the Bilinear Cohesive Zone Model

Determination of the Interface Properties in an Elastic Film/substrate System

The peeling behavior of a heterogeneous elastic film on a rigid substrate

Effect of thin-film length on the peeling behavior of film-substrate interfaces.

Rate-dependent Peeling Behavior of the Viscoelastic Film-Substrate System

Quantitative prediction of the whole peeling process of an elastic film on a rigid substrate

Competing Behavior of Interface Delamination and Wafer Cracking During Peeling Film from Ultra-Thin Wafer

The interface effect on the whole peeling behavior of an elastic thin-film

Exploiting Interfacial Instability During Peeling a Flexible Plate from Elastic Films

90-degree peeling of elastic thin films from elastic soft substrates: Theoretical solutions and experimental verification

Effect of Bending Stiffness on the Peeling Behavior of an Elastic Thin Film on A Rigid Substrate

Self-Debonding of Adhesive Thin Films on Convex Cylindrical Surfaces and Spherical Surfaces

Modeling Interfacial Instability Patterns During Debonding a Rigid Spherical Indenter from Thin Elastic Films

On debonding of thin films

Determination of mechanical properties of film and interface using overhang beam bending method

Multiple kinds of peeling processes and instabilities in heterogeneous film peeling

Decohesion of graphene from a uniaxially-stretched substrate: Failure analysis of a frictional adhesive interface

The Interfacial Behavior of an Axisymmetric Film Bonded to a Graded Inhomogeneous Substrate

Enhanced and Weakened Strength in Brittle Film-Substrate Structure

The Peeling Behavior of Film/substrate Systems with Periodic and Discontinuous Bonding