Abstract:The immoderate growth of intermetallic compounds (IMCs) and the transformation of benign IMCs to malignant IMCs are the main causes for the decrease of the mechanical properties and reliability in the Cu-Sn joints. In this study, a 14 nm thickness reduced graphene oxide (rGO) interlayer was directly prepared between Cu and Sn-3.0 Ag-0.5 Cu (SAC305) solder to inhibit the immoderate growth of IMCs and malignant IMCs formation at the bonding interface. The highly reliable Cu-Cu bonding was realized at 150 C under the external pressure of ~8.3 MPa. The bonded samples were aged at 150 C for 0 h-72 h for reliability tests. After aging for 72 h, the thickness of the IMCs layer at the Cu/rGO/solder interface decreases by more than 30%, and the average projected area of IMCs grains decreases by more than 80% compared with that at the Cu/solder interface. Furthermore, the decreasing rate of shear strength with rGO interlayer is lower than that without rGO interlayer for long time aging. For the Cu/rGO/solder bonding structure, after 72 h aging, the shear strength is higher and the contact resistance is lower compared with the Cu/solder bonding structure. For this low temperature bonding process using the rGO interlayer, the immoderate growth of IMCs at the bonding interface was inhibited, which can delay the decrease of shear strength due to aging of the bonding interface.

Highly Reliable Cu-Cu Low Temperature Bonding Using SAC305 Solder with Rgo Interlayer