3D Assembly: Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches (adv. Mater. 36/2019)

Xu Cheng,Yihui Zhang
DOI: https://doi.org/10.1002/adma.201970254
IF: 29.4
2019-01-01
Advanced Materials
Abstract:Advanced MaterialsVolume 31, Issue 36 1970254 Inside Front CoverFree Access 3D Assembly: Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches (Adv. Mater. 36/2019) Xu Cheng, Xu Cheng AML, Department of Engineering Mechanics, Beijing, 100084 China Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this authorYihui Zhang, Yihui Zhang AML, Department of Engineering Mechanics, Beijing, 100084 China Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this author Xu Cheng, Xu Cheng AML, Department of Engineering Mechanics, Beijing, 100084 China Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this authorYihui Zhang, Yihui Zhang AML, Department of Engineering Mechanics, Beijing, 100084 China Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084 ChinaSearch for more papers by this author First published: 03 September 2019 https://doi.org/10.1002/adma.201970254Citations: 1AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinked InRedditWechat Abstract In article number 1901895, Yihui Zhang and Xu Cheng discuss the latest progress and new perspectives of micro-/nanoscale 3D assembly, highlighting the various methods, through rolling, folding, curving, and buckling assembly. Owing to their broad-ranging applicability to different material systems, the resulting 3D micro-/nanostructures have compelling applications in widespread areas, from electronics/optoelectronics, and microelectromechanical systems (MEMS), to medical devices and cell scaffolds. Citing Literature Volume31, Issue36September 6, 20191970254 RelatedInformation
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