Significantly enhanced dielectric and hydrophobic properties of SiO<sub>2</sub>@MgO/PMMA composite films

Yuting Xia,Jiayun Chen,Zhicai Zhu,Qilong Zhang,Hui Yang,Qianqian Wang

DOI: https://doi.org/10.1039/c7ra12695f

IF: 4.036

2018-01-01

RSC Advances

Abstract:In this article, we provide a feasible method to prepare high-dielectric-constant hydrophobic composite films, which show potential application as the insulator layer in electrowetting devices.

What problem does this paper attempt to address?

Significantly Enhanced Dielectric and Hydrophobic Properties of SiO2@MgO/PMMA Composite Films

Yuting Xia,Jiayun Chen,Zhicai Zhu,Qilong Zhang,Hui Yang,Qianqian Wang

DOI: https://doi.org/10.1039/c7ra12695f

IF: 4.036

2018-01-01

RSC Advances

Abstract:In this article, we provide a feasible method to prepare high-dielectric-constant hydrophobic composite films, which show potential application as the insulator layer in electrowetting devices. SiO2@MgO core-shell nanoparticles were fabricated via a hydrolysis process and embedded into the PMMA matrix. The microstructure of the nanoparticles and the cross-section of the films indicated that a SiO2 coating has successfully been prepared around the MgO particles with a thickness of about 20-30 nm and the nanofillers were homogeneously dispersed in the polymer. Hydrophobic films (contact angle similar to 115 degrees) with appropriate glass transition temperature were obtained. The dielectric constant at various frequencies of the functional fillers enhanced with increasing the SiO2@MgO filler content. The results suggested that SiO2@MgO is more effective in increasing the dielectric constant of PMMA when compared with MgO sheets. Typically, the dielectric constant of the PMMA composite filled with 40 wt% SiO2@MgO reaches 19.1 at 40 Hz, in contrast to 9.7 for the composite filled with 40 wt% MgO sheets and 3.8 for pristine PMMA. Also, the composites exhibited low electrical conductivity (<= 10(-7)) even at high frequency. All the improved performances showed potential application in the dielectric layer of electrowetting devices.
anced dielectric and hydrophobic properties of SiO 2 @ MgO / PMMA composite fi lms

Yuting Xia,Jiayun Chen,Zhicai Zhu,Qilong Zhang,Hui Yang,Qianqian Wang

2018-01-01

Abstract:In this article, we provide a feasible method to prepare high-dielectric-constant hydrophobic composite films, which show potential application as the insulator layer in electrowetting devices. SiO2@MgO core– shell nanoparticles were fabricated via a hydrolysis process and embedded into the PMMA matrix. The microstructure of the nanoparticles and the cross-section of the films indicated that a SiO2 coating has successfully been prepared around the MgO particles with a thickness of about 20–30 nm and the nanofillers were homogeneously dispersed in the polymer. Hydrophobic films (contact angle 115 ) with appropriate glass transition temperature were obtained. The dielectric constant at various frequencies of the functional fillers enhanced with increasing the SiO2@MgO filler content. The results suggested that SiO2@MgO is more effective in increasing the dielectric constant of PMMA when compared with MgO sheets. Typically, the dielectric constant of the PMMA composite filled with 40 wt% SiO2@MgO reaches 19.1 at 40 Hz, in contrast to 9.7 for the composite filled with 40 wt% MgO sheets and 3.8 for pristine PMMA. Also, the composites exhibited low electrical conductivity (#10 ) even at high frequency. All the improved performances showed potential application in the dielectric layer of electrowetting devices.
Hybrid films with excellent oxygen and water vapor barrier properties as efficient anticorrosive coatings

Jiajie Wang,Ting Pan,Jian Zhang,Xiaozhi Xu,Qing Yin,Jingbin Han,Min Wei

DOI: https://doi.org/10.1039/c8ra03819h

IF: 4.036

2018-01-01

RSC Advances

Abstract:A hydrophobic film is fabricated by spin-coating of Tween 80 modified layered double hydroxide and polydimethylsiloxane alternately, which displays enhanced oxygen/water vapor barrier properties and anti-corrosion behavior toward metal substrates.

chemistry, multidisciplinary
Robust Superhydrophobic SiO2/polydimethylsiloxane Films Coated on Mild Steel for Corrosion Protection

Xue-Fen Zhang,Yi-Qing Chen,Ji-Ming Hu

DOI: https://doi.org/10.1016/j.corsci.2020.108452

IF: 7.72

2020-01-01

Corrosion Science

Abstract:One of the biggest obstacles for superhydrophobic films in applications is their poor mechanical resistance. In this research, robust superhydrophobic SiO2 films were constructed on mild steel (MS) for corrosion protection by the combination of rough electrodeposited SiO2 (E-SiO2) films and durable polydimethylsiloxane (PDMS) polymer with low surface energy. Results show that the PDMS content has a great effect on the microtopography, wettability, roughness, and wear-resistance of the final films. EIS measurements indicate that as-prepared robust superhydrophobic E-SiO2/PDMS films exhibit good corrosion inhibition efficiency of up to 99.99 % for MS substrates in 3.5 wt.% NaCl solution.
Hydrophobic Multilayered PEG@PAN/MXene/PVDF@SiO2 Composite Film with Excellent Thermal Management and Electromagnetic Interference Shielding for Electronic Devices

Jiahui Lin,Jintao Huang,Zhanhu Guo,Ben Bin Xu,Yan Cao,Juanna Ren,Hua Hou,Yongshuang Xiao,Mustafa Elashiry,Zeinhom M El-Bahy,Yonggang Min

DOI: https://doi.org/10.1002/smll.202402938

IF: 13.3

2024-08-07

Small

Abstract:With the rapid development of electronic industry, it's pressing to develop multifunctional electromagnetic interference (EMI) shielding materials to ensure the stable operation of electronic devices. Herein, multilayered flexible PEG@PAN/MXene (Ti3C2Tx)/PVDF@SiO2 (PMF) composite film has been constructed from the level of microstructure design via coaxial electrospinning, coating spraying, and uniaxial electrospinning strategies. Benefiting from the effective encapsulation for PEG and high conductivity of MXene coating, PEG@PAN/MXene composite film with MXene coating loading density of 0.70 mg cm-2 exhibits high thermal energy storage density of 120.77 J g-1 and great EMI shielding performance (EMI SE of 34.409 dB and SSE of 49.086 dB cm3 g-1) in X-band (8-12 GHz). Therefore, this advanced composite film can not only help electronic devices prevent the influence of electromagnetic pollution in the X-band but also play an important role in electronic device thermal management. Additionally, the deposition of nano PVDF@SiO2 fibers (289 ± 128 nm) endowed the PMF composite film with great hydrophobic properties (water contact angle of 126.5°) to ensure the stable working of hydrophilic MXene coating, thereby breaks the limitation of humid application environments. The finding paves a new way for the development of novel multifunctional EMI shielding composite films for electronic devices.
Enhanced Dielectric and Hydrophobic Properties of PDMS/P(VDF-TrFE) Blend Films by Embedding PS Microspheres

Qilong Zhang,Zhicai Zhu,Da Shen,Hui Yang

DOI: https://doi.org/10.1016/j.colsurfa.2019.03.006

IF: 5.518

2019-01-01

Colloids and Surfaces A Physicochemical and Engineering Aspects

Abstract:This paper reports a feasible method to prepare pure organic polymeric nanocomposites with enhanced dielectric and hydrophobic performance. Homogeneous polystyrene (PS) microspheres with an average diameter of about 250 nm was firstly synthesized through emulsion polymerization. The blend film containing PS, PDMS and P(VDF-TrFE) are prepared by a simple solution-blending and spin-coating method. The blend film exhibits enhanced dielectric and hydrophobic properties. Typically, the dielectric constant of the blend film with 23 wt% PS reaches 21 at 100 Hz, which is 3 times that of PDMS/P(VDF-TrFE) (mass ratio: 2/3) due to enhanced interfacial polarization caused by PS addition. Meanwhile, the blend film with 23 wt% PS possesses a large apparent contact angle of 125 degrees because the presence of a rough surface makes the solid-liquid contact surface larger than the apparently observed area, thus enhancing hydrophobicity. All the improved performances show great potential application for electrowetting devices.
DIELECTRIC BEHAVIORS OF ZnFe2O4 – SiO2 COMPOSITE THIN FILMS PREPARED BY SOL-GEL METHOD

H Jiang,HW Liu,H Yu,F Gao,JM Liu

DOI: https://doi.org/10.1142/s0217979205031523

2005-01-01

International Journal of Modern Physics B

Abstract:The dielectric property of ZnFe2O4 – SiO2 composite thin films deposited on Pt - Ti -SiO2- Si substrates, prepared by sol-gel method, are investigated. It is observed that the thin films consist of ZnFe2O4 nanoparticles embedded in the matrix of SiO2. Such a composite structure exhibits a significantly enhanced dielectric constant with respect to SiO2 thin films without too large dielectric loss enhancement.
Dielectric properties and dielectric relaxation process of polymethylphenylsiloxane/silicon dioxide nanocomposites

Yan Yu,Yan Zhao,Bin Huang,Yanwei Ji,Yunfeng Zhao,Zhijie Zhang,Hua‐Feng Fei

DOI: https://doi.org/10.1002/app.52716

IF: 3

2022-06-04

Journal of Applied Polymer Science

Abstract:In recent years, polysiloxane dielectric elastomers (DEs) have attracted extensive attention, but their low dielectric constant and electrical breakdown strength are the main factors that limit their wide application. In this work, we report the effects that a high content of hydrophobic silica has on the dielectric properties and dielectric relaxation behavior of polymethylphenylsiloxane (PMPS). Introducing a high content of hydrophobic silica into PMPS composites increased the dielectric constant of PMPS composites from 3.11 to 3.70 and the breakdown strength of PMPS composites from 35.31 to 42.66 kv/mm. The high content of hydrophobic silica is beneficial for restraining or delaying the occurrence of direct current (DC) conductivity and for effectively reducing the dielectric loss of composites in high temperature and low‐frequency regions. The high content of hydrophobic silica also produces interfacial polarization in the composites, and this increases the dielectric constant and dielectric loss in the high frequency and low‐temperature regions. The dielectric relaxation behavior of PMPS composites was studied in detail using broadband dielectric spectroscopy (BDS) and thermally stimulated depolarization current (TSDC) to better understand the effect of hydrophobic silica on dielectric properties. This work opens a new way to design and prepare polysiloxane‐based materials that have a high dielectric constant, low dielectric loss, and high breakdown strength.

polymer science
Enhanced Dielectric Constant and Hydrophobicity of P(VDF–TrFE)-based Composites

Jiayun Chen,Xiaoying Xiong,Lingling Shui,Qilong Zhang,Hui Yang,Fang Zhang

DOI: https://doi.org/10.1007/s10854-018-9864-8

2018-01-01

Journal of Materials Science Materials in Electronics

Abstract:In this research, we report a facile and low-lost method to prepare single-layer hybrid films with high permittivity and hydrophobicity, which exhibited promising potential application as insulator layer in low-voltage electrowetting devices. α-terpineol treated BaTiO3 nanoparticles with less agglomeration were incorporated into P(VDF–TrFE) matrix. The dielectric behavior and hydrophobic property of these composites were studied. Typically, the composite with 25 vol% surface treated BaTiO3 nanoparticles reveals dielectric constant of 46.5, three times of that of pure P(VDF–TrFE), and a lower dielectric loss of 0.091 at 103 Hz compared to the composite filled with commercial BaTiO3 nanoparticles, although its breakdown strength still remains 100 MV m−1. Besides, electric conductivity of all the composites were lower than 10−7 S cm−1 even at high frequency, indicating their excellent insulativity. Further, the composites film exhibits the high static contact angle with excellent AC electrowetting response. These results demonstrated the great potential of such single-layer composite film for low-voltage electrowetting devices.
Polyimide/fluorinated silica composite films with low dielectric constant and low water absorption

Bingliang Huang,Ke Li,Mingyun Peng,Jie Cheng

DOI: https://doi.org/10.1177/09540083211073657

IF: 1.73

2022-02-14

High Performance Polymers

Abstract:In this study, KMnO4 was applied as an etchant to partially decompose the silica microspheres into mesoporous structures. 1H,1H,2H,2H-perfluorodecyltriethoxysilane was grafted onto the surface of the hollow silica. A fluorinated silica/polyimide hybrid material was prepared. Meanwhile, the influence of fluorinated silica on the dielectric property and moisture absorption property of the hybrid material was discussed. It is found that the fluorinated silica can lower the dielectric constant and hygroscopicity of the hybrid film. The fluorinated silica is characterized by strong hydrophobicity, good dispersibility, and good thermal stability. Even at a very low filling level of only 2 wt%, the dielectric constant of the polyimide hybrid is significantly reduced to 2.61 without sacrificing thermal stability. The water absorption rate of the polyimide hybrid film is reduced from approximately 3.1% to 2.1 wt%. Moreover, this provides a new idea for reducing the dielectric and water absorption properties of materials.

polymer science
Mechanical Enhancement and Dielectric Properties of SiO 2 Contained Polyimides under High Frequency

Heming Li,Xinming Wang,Tao Wu,Yuze Gong,Hongbin Zhao,Zhaobin Liu,Davoud Dastan,Ke Ma,Zhizhi Hu

DOI: https://doi.org/10.1007/s10854-023-11731-w

2023-01-01

Journal of Materials Science Materials in Electronics

Abstract:Communication industry has developed relying on technological advancement in microelectronics and large-scale integrated circuits. Modified polyimide (MPI) materials with low dielectric loss, relatively simple fabrication process, and cost-effectiveness have significant social and economic benefits. In this work, 6FAPB and 6FDA were used to polymerize fluorinated PI films by thermal imidization, and SiO 2 was used to modify PI films for further obtaining low dielectric constant ( ε )/loss (tan δ ) and enhance mechanical properties. The values of dielectric constant ( ε ) and tan δ were 2.75 and 0.00491, respectively, under 10 GHz. Meanwhile, the elastic modulus of MPI films was enhanced by the SiO 2 adding process, with a maximum tensile modulus of 2.42 GPa. The results indicate that low polarity Si–O–Si bonds lead to a decrease in overall polarity of PI films and lead to tan decrease. This work provides a simple method to increase mechanical properties and reduce the dielectric constant/loss (at 10 GHz high frequency) of PI film by introducing trifluoromethyl and SiO 2 .
Highly reliable double-layer coatings on magnesium alloy surfaces for robust superhydrophobicity, chemical durability and electrical property

Shuqi Wang,Yaming Wang,Gui Cao,Junchen Chen,Yongchun Zou,Bo Yang,Jiahu Ouyang,Dechang Jia,Yu Zhou

DOI: https://doi.org/10.1016/j.ceramint.2021.09.045

IF: 5.532

2021-12-01

Ceramics International

Abstract:The long application life and reliable performance of magnesium alloys have been putting forward strict requirements for both better chemical stability and functional characteristics of protective coating. Herein, a highly reliable superhydrophobic double-layer coating on AZ31 Mg with excellent anti-corrosion and electrical protection was achieved by assembling modified SiO2-based organic-inorganic hybrid films on Plasma Electrolytic Oxidation (PEO) ceramic bottom layer. The coating exhibits preferable antiwater surfaces with a barrier layer isolating the underlying substrate from the external environment, rendering a long-term active corrosion protection for the multilayer covered magnesium alloy. Remarkably, the coating achieves high electric insulation with volume resistivity of 1.7 × 1012 Ω cm, breakdown voltage of 1405.2 ± 117.1 V and dielectric strength of 40.2 ± 3.3 V/μm. Simultaneously, its dielectric properties with a low dielectric constant (ε ≈ 3.75) and a low dielectric loss (tan δ ≈ 0.0058) outperform those of some current dielectric coatings with similar components. Moreover, the superhydrophobic coating displays strong mechanical robustness undergoing 50th linear abrasion, superior environmental stability (thermal shock, prolonged solution immersion, salt-spray corrosion and UV irradiation), and high adhesion strength. The excellent multifunction benefits from the introduction of ceramic bottom layer, the assembly of compact nanocomposite films, and the synergistic effect of organic-inorganic components. This study provides a new inspiration for designing advanced protective coating with a great potential for the applications of sensitive electronic devices.

materials science, ceramics
Interface modified Si@SiO<sub>2</sub>/PVDF composite dielectrics with synchronously ameliorative dielectric and mechanical properties

Fanrong Kong,Wenying Zhou,Weiwei Peng,Chen Liang,Hongju Wu,Na Lin,Guangheng Wang,Dengfeng Liu,Aihong Feng,Xiangrong Liu

DOI: https://doi.org/10.1002/app.54214

IF: 3

2023-01-01

Journal of Applied Polymer Science

Abstract:To efficaciously decrease dielectric loss while still synchronously harvesting a high dielectric constant (e ') and breakdown strength (E-b), as well as good mechanical properties in silicon (Si)/poly(vinylidene fluoride) (PVDF), in this work, the core@shell structured Si@silicon dioxide (SiO2) particles were first prepared via a high temperature oxidation, and subsequently incorporated into the PVDF to generate morphology-dependent composites with a high-e ' and E-b but low loss. The SiO2 shell effects on the morphology, dielectric, and mechanical properties of PVDF composites were explored. In comparison to pristine Si/PVDF, the Si@SiO2/PVDF presents significantly suppressed loss and boosted E-b because the SiO2 interlayer not only efficiently blocks the connection between the raw Si and greatly impedes the long-range charges migration even at high filler loadings, but also obviously improves the compatibility between Si and PVDF at the interfaces which promotes fillers' uniform dispersion in host matrix, thus leading to enhanced dielectric and mechanical properties. The fitting result by the Havriliak-Negami equation theoretically elucidates the SiO2 interlayer's suppression effect on charge migration behavior in the composites. More importantly, dielectric properties can be efficiently turned via tailoring the SiO2 shell thickness. The Si@SiO2/PVDF with simultaneously enhanced dielectric and mechanical performances shows promising uses in the electrical and microelectronics industries.
Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction

Xiaodi Dong,Baoquan Wan,Yang Feng,Daomin Min,Ming-Sheng Zheng,Haiping Xu,Zhi-Min Dang,George Chen,Jun-Wei Zha

DOI: https://doi.org/10.1016/j.eurpolymj.2022.111667

IF: 6

2022-12-05

European Polymer Journal

Abstract:Dielectric materials with low permittivity are urgently needed in the field of microelectronics due to the development of integration and miniaturization of integrated circuits. In this work, a series of all-organic polyimide (PI) films with ultra-low-permittivity and high hydrophobicity were successfully synthesized by introducing a kind of fluoroelastomer (FEM). And the significant permittivity reduction phenomenon was discussed through molecular dynamics simulations and practical tests. It was assumed that the hydrogen bond significantly inhibited the dipolar polarization of the FEM/PI composite system, which played an important role in determining the dielectric properties of FEM/PI composite films. At a low filler content of 7 wt%, FEM/PI composites exhibited the optimum permittivity (ε) of 1.21 at 106 Hz, which was the lowest permittivity of the PI films, while a low water absorption of 0.44 % and high thermal stability with a 10 % decomposition temperature (Td10%) of 548 °C were also observed. This simple and effective strategy of fabricating ultra-low-permittivity PI film is a potential way to realize commercial process.

polymer science
Preparation and Research of Organic-inorganic Hydrophobic SiO2 Composite Films

Gang XU,Ling-hang WANG,Wei-xing CHEN

DOI: https://doi.org/10.3969/j.issn.1673-9965.2007.03.014

2007-01-01

Abstract:Hydrophobic non-fluorine SiO2 coextruded film was prepared from Si(OC2H5)4 and CnH2n+1Si(OCH3)3(n=7～12) instead of Fluoro-organosilane using Sol-Gel method.The character of colloid was inferred from thermogravimetric analysis(TG) and differential thermal analysis(DTA).IR transmittance of films heat-treated at different temperature was examined.The surface of film was characterized by SEM.Anticorrosion and cohesion properties were also discussed here.The results indicate that the heat treatment temperature of the composite thin film should be lower than 300 ℃ to avoid the burning of-CH3.After heat treatment,the content of SiO2 of film increases.The average contact angle of thin films increases with the increment of coating times,and the max value is 110.2°.The films have better hydrophobicity,anticorrosion and cohesion,which amount to the best grade according to GB1720-88.
Modified Sepiolite/pvdf‐hfp Composite Film with Enhanced Piezoelectric and Dielectric Properties

Shaojie Zhang,Wangshu Tong,Jiang Wang,Wenjiang Wang,Zhihao Wang,Yihe Zhang

DOI: https://doi.org/10.1002/app.48412

IF: 3

2019-01-01

Journal of Applied Polymer Science

Abstract:ABSTRACTFlexible film with both piezoelectric and dielectric properties is considered to be a potential candidate for the energy conversion and storage devices. In this study, the Li+ and H2O modified sepiolite/poly(vinylidene fluoride‐co‐hexafluoropropylene) (LiSEP‐H2O/PVDF‐HFP) composite films with both good piezoelectric and dielectric properties were prepared by traditional coating process. When the H2O content was 13 wt %, the LiSEP‐H2O/PVDF‐HFP composite exhibited high d33 of 32 and dielectric constant of 48. Moreover, the effects of the Li+ and adsorbed H2O on the d33, F(β), dielectric constant, short‐circuit currents were discussed. The adsorbed H2O enhanced the β‐phase by the hydrogen bonds and Li+ improved the polarization to realize the composite film with increased piezoelectric and dielectric properties respectively. We expected the common modification to lead other clay minerals realizing the future applications in the adjustment of composites' electric properties. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48412.
Investigation into Elevated Dielectric Properties of Molybdenum Particle /PVDF Composites by Engineering Insulating Silica Shell As an Interlayer

Yanqing Zhang,Wenying Zhou,Enxi Zhang,Ying Li,Yingjia Feng,Jing Liu,Nan Zhang,Huiwu Cai,Mengxue Yuan

DOI: https://doi.org/10.1016/j.matchemphys.2024.129153

IF: 4.778

2024-01-01

Materials Chemistry and Physics

Abstract:The urgent requirement for high reliability and increasingly miniaturized electronic devices necessitates packaging polymers with giant dielectric constant (ε′), low loss and high breakdown strength (Eb). To significantly restrain the dielectric loss and leakage current of molybdenum (Mo)/poly (vinylidene fluoride, PVDF) while still holding a large ε′, the silica (SiO2) encapsulated Mo core@shell structured particles were prepared in this work utilizing a sol-gel method, and then composited with PVDF to explore the silica shell's impact and regulating effect on the dielectric properties of the PVDF composites. The findings on the relationship between microstructure and dielectric properties showcase that the introduced SiO2 interlayer not only enhances the interface interactions but also mitigates the great interfacial mismatch in both ε′ and conductivity between the two components, resulting in elevated Eb of the composites. Moreover, the dielectric loss and conductivity of the composites can be remarkably reduced because the silica shell introduces deep traps inhibiting the passage of long-distance electron migration. And the overall dielectric properties of the Mo@SiO2/PVDF can be effectively tuned by modifying the Mo@SiO2's electric resistivity and optimizing the shell thickness. This work provides a beneficial strategy for the design and preparation of dielectric composites with superior dielectric performances for prospective applications.
Enhanced Dielectric and Hydrophobic Properties of Poly(vinylidene fluoride-trifluoroethylene)/TiO2 Nanowire Arrays Composite Film Surface Modified by Electrospinning

Da Shen,Qilong Zhang,Zhao Zhang,Hui Yang,Jiansong Sheng

DOI: https://doi.org/10.3390/polym13010105

IF: 5

2020-12-29

Polymers

Abstract:In this research, we designed a feasible method to prepare composite films with high permittivity and significantly enhanced hydrophobic performance, which showed huge potential in the electrowetting field. TiO2 nanowire arrays were prepared by a one-step hydrothermal process, and poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) was spin-coated on the nanowire arrays to form composite, the surface of which was modified by electrospinning. Due to the great orientation of TiO2 nanowires, dipoles and space charges are in ordered arrangement along the electric field, and this strongly reinforced the Maxwell–Wagner–Sillars (MWS) polarization, thus the permittivity of the composite (TiO2 nanowire length/film thickness is 0.769) reaches 53 at 1 kHz, which is nearly 3 times higher than pure P(VDF-TrFE). Meanwhile the composite film possesses low dielectric loss (0.07) and low conductivity (2.69 × 10−9 S/cm), showing good insulation. The contact angle of the composite after electrospinning (about 137°) was greatly enhanced from pure P(VDF-TrFE) spin-coated film (about 89°), which can be attributed to the microrough structure built by P(VDF-TrFE) nanofibers.

polymer science
Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Ke Li,Lin Yang,Lin Yang,Liu He,Juan Du,Xinyue Li

DOI: https://doi.org/10.1002/pen.26910

2024-08-09

Polymer Engineering & Science

Abstract:Low dielectric polyimide microsphere/polyimide composite films composite film with good comprehensive properties was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. A low dielectric polyimide/polyimide microsphere (PI/PM) composite film was constructed by thermal imidization of polyamic acid from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) in the presence of porous PM. The PM particles with particle size of about 2 μm were prepared via the solvothermal method using 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and ODA as monomers through thermal imidization. Due to the favorable compatibility between the porous PM and PI matrix, the mechanical properties, thermal stability, and dielectric properties of the obtained composite films were significantly improved. The PI/PM composite films had a tensile strength of 44.18–64.32 MPa, and the corresponding elongation at break of 6.21%–11.7%. Furthermore, the thermogravimetric temperatures of T5% were 538.9–563.7°C. The dielectric constants of the composite films at 1 MHz were 2.59–3.68, and the corresponding dielectric loss were only 0.0119–0.00405. Thus, the combination of excellent mechanical properties, high thermal stability, extremely low dielectric constant, and dielectric loss make the composite films ideal for deployment as high‐performance materials for 5G applications. Highlights Low dielectric polyimide composite film was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. Porous polyimide microspheres were prepared by thermal using the imidization solvothermal method. Low dielectric polyimide composite film with good comprehensive properties.

engineering, chemical,polymer science
Synthesis and performance of hydroxyl‐terminated polysiloxane‐modified polyurethane acrylate films as potential flexible hydrophobic materials

Min Zhao,Mingda Yang,Ahmed Olalekan Omoniyi,Jiatong Xu,Yang Zhou,Chenyang Zou,Jianfu Zhang

DOI: https://doi.org/10.1002/app.54272

IF: 3

2023-06-17

Journal of Applied Polymer Science

Abstract:A solvent‐free method was used to synthesize composite emulsions (HSi‐PUA) with hydroxyl‐terminated polydimethylsiloxane (HP‐PDMS) siloxane monomer introduced into the PUA system as a soft segment, and then polymer films were prepared from emulsions. The films prepared from emulsions showed improved surface hydrophobicity and flexibility. The obtained flexible hydrophobic film materials are expected to show certain application potential in the field of construction and wearable devices. Hydrophobic materials possess exceptional properties, making them extensively useful in daily production and life. However, developing low‐cost and flexible hydrophobic materials remains a challenging task. In this study, a series of composite emulsions were prepared by introducing hydroxyl‐terminated polydimethylsiloxane as a modifier into polyurethane acrylate via a solvent‐free approach. The composite emulsions were then used to fabricate polymer films using the solvent evaporation technique. The effects of varying siloxane content on the properties of composite emulsions and polymer membranes were examined. The results showed that increasing the siloxane content improved the hydrophobic properties and flexibility of the film materials. Fourier transform infrared spectroscopy confirmed the introduction of the SiOSi group into the polyurethane chain structure, the absorption peak for asymmetric stretching vibration of SiOSi is at 1100 cm−1. The mechanical properties test revealed that the film had excellent elongation at break (278.96 ± 0.01%), and a hydrophobic surface with a contact angle of 101.94° was obtained. The composite materials showed improved water resistance and thermal stability with the increase in siloxane content. The hydrophobic film is a promising material for application in decoration, architecture, and flexible wearable devices.

polymer science

Significantly enhanced dielectric and hydrophobic properties of SiO<sub>2</sub>@MgO/PMMA composite films

Significantly Enhanced Dielectric and Hydrophobic Properties of SiO2@MgO/PMMA Composite Films

anced dielectric and hydrophobic properties of SiO 2 @ MgO / PMMA composite fi lms

Hybrid films with excellent oxygen and water vapor barrier properties as efficient anticorrosive coatings

Robust Superhydrophobic SiO2/polydimethylsiloxane Films Coated on Mild Steel for Corrosion Protection

Hydrophobic Multilayered PEG@PAN/MXene/PVDF@SiO2 Composite Film with Excellent Thermal Management and Electromagnetic Interference Shielding for Electronic Devices

Enhanced Dielectric and Hydrophobic Properties of PDMS/P(VDF-TrFE) Blend Films by Embedding PS Microspheres

DIELECTRIC BEHAVIORS OF ZnFe2O4 – SiO2 COMPOSITE THIN FILMS PREPARED BY SOL-GEL METHOD

Dielectric properties and dielectric relaxation process of polymethylphenylsiloxane/silicon dioxide nanocomposites

Enhanced Dielectric Constant and Hydrophobicity of P(VDF–TrFE)-based Composites

Polyimide/fluorinated silica composite films with low dielectric constant and low water absorption

Mechanical Enhancement and Dielectric Properties of SiO 2 Contained Polyimides under High Frequency

Highly reliable double-layer coatings on magnesium alloy surfaces for robust superhydrophobicity, chemical durability and electrical property

Interface modified Si@SiO<sub>2</sub>/PVDF composite dielectrics with synchronously ameliorative dielectric and mechanical properties

Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction

Preparation and Research of Organic-inorganic Hydrophobic SiO2 Composite Films

Modified Sepiolite/pvdf‐hfp Composite Film with Enhanced Piezoelectric and Dielectric Properties

Investigation into Elevated Dielectric Properties of Molybdenum Particle /PVDF Composites by Engineering Insulating Silica Shell As an Interlayer

Enhanced Dielectric and Hydrophobic Properties of Poly(vinylidene fluoride-trifluoroethylene)/TiO2 Nanowire Arrays Composite Film Surface Modified by Electrospinning

Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Synthesis and performance of hydroxyl‐terminated polysiloxane‐modified polyurethane acrylate films as potential flexible hydrophobic materials