A021 Experimental Investigation of Material Removal Mechanism in Ultrasonic Assisted Grinding of SiC Ceramics Using a Single Diamond Tool

Jianguo Cao,Yongbo Wu,Huiru Guo,Masakazu Fujimoto,Nomura Mitsuyoshi

DOI: https://doi.org/10.1299/jsmelem.2013.7.93

2013-01-01

Proceedings of International Conference on Leading Edge Manufacturing in 21st century LEM21

Abstract:To expose the material removal mechanism in ultrasonic assisted grinding (UAG) of SiC ceramics, the deformation features of SiC ceramics in ultrasonic assisted scratching (UAS) tests were investigated and compared with those in conventional scratching (CS). The results revealed that the scratching force varies periodically and the scratching trace appears to be sinusoidal in UAS. It was also found that the scratching groove generated in CAS is deeper than that in CS and the sizes of lateral cracks are increased owing to the impact of the tool generated in UAS process.