Changes in stresses sensitivity of ohmic heating-induced sublethally injured Staphylococcus aureus during repair: Potential mechanisms at the cellular and molecular levels
Han Wang,Lele Shao,Yana Liu,Yingying Sun,Bo Zou,Yijie Zhao,Yuhan Wang,Xingmin Li,Ruitong Dai
DOI: https://doi.org/10.1016/j.ijfoodmicro.2024.110814
2024-09-16
Abstract:Ohmic heating (OH), an emerging food processing technology employed in the food processing industry, raises potential food safety concerns due to the recovery of sublethally injured pathogens such as Staphylococcus aureus (S. aureus). In the present study, sensitivity to various stress conditions and the changes in cellular-related factors of OH-injured S. aureus during repair were investigated. The results indicated that liquid media differences (nutrient broth (NB), phosphate-buffered saline (PBS), milk, and cucumber juice) affected the recovery process of injured cells. Nutrient enrichment determines the bacterial repair rate, and the rates of repair for these media were milk > NB > cucumber juice > PBS. The sensitivity of injured cells to various stressors, including different acids, temperature, nisin, simulated gastric fluid, and bile salt, increased during the injury phase and subsequently diminished upon repair. Additionally, the intracellular ATP content, enzyme activities (Na+/K+-ATPase, Ca2+/Mg2+-ATPase, and T-ATPase) and ion concentrations (Mg2+, K+, and Ca2+) gradually increased during repair. After 5 h of repair, the intracellular substances content of cell's was significantly higher than that of the injured bacteria without repair, while some indicators (e.g., Na+/K+-ATPase, K+, and Ca2+) were not restored to the untreated level. The results of this study indicated that OH-injured S. aureus exhibited strengthened resistance post-recovery, potentially due to the restoration of cellular structures. These findings have implications for optimizing food storage conditions and advancing OH processes in the food industry.