Solvent Resistant Hole-Transporting Thin Films Via Diacetylene Cross-Linking and Their Applications in Solution-Processed QLEDs

Wenjian Sun,Yunzhou Deng,Yizheng Jin,Xiaojun Guo,Qing Zhang
DOI: https://doi.org/10.1021/acsapm.0c00427
2020-01-01
ACS Applied Polymer Materials
Abstract:A diacetylene-based thermal cross-linking method for hole-transporting layers (HTLs) has been investigated. The thin films of 4,4-bis(carbazol-9-yl)biphenyl (CBP) oligomers functionalized with diacetylene groups were cross-linked at 150 degrees C. The cross-linked thin films showed smooth surface morphologies and solvent stabilities in chloroform, chlorobenzene, indane, 3,5-dimethylanisole, and so on. The quantum dot lightemitting diode (QLED) devices based on the cross-linked HTLs displayed high current density, large maximum brightness, long device lifetime, and comparable external quantum efficiency in comparison with the corresponding devices based on the pristine HTLs. The hole-transporting properties of the cross-linked and the pristine HTLs were also studied in hole-only devices (HODs). This cross-linking method could be potentially useful in solution fabrication of multilayer organic electronic devices.
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