A New Reutilization Strategy of Waste Printed Circuit Board Nonmetal Powders for Constructing Superhydrophobic Coatings

Wei Liu,Dechao Hu,Huaqing Liu,Wenshi Ma
DOI: https://doi.org/10.1002/pen.25747
2021-01-01
Abstract:Reutilization of waste printed circuit board nonmetal powders (WPCBP) has been one of the major bottlenecks in the comprehensive utilization of electronic wastes. Herein, a new reutilization strategy of WPCBP was innovatively proposed to develop a superhydrophobic coating. Typically, WPCBP@SiO2 hybrid filler was successfully prepared by the in-situ growth of silica on WPCBP surface, and the structures and compositions of WPCBP@SiO2 were systematically investigated by SEM, FTIR, and TGA. Then the obtained WPCBP@SiO2 was combined with polydimethylsiloxane (PDMS) to prepare a superhydrophobic coating. The as-prepared PDMS/WPCBP@SiO2 coatings exhibited excellent superhydrophobicity and self-cleaning ability, whose static water contact angle (WCA) is more than 150 degrees while the sliding angle (SA) is <10 degrees. In summary, this study provides a green and efficient reutilization strategy of WPCBP in superhydrophobic coatings, which may open up a new opportunity for the high-valued utilization of WPCBP.
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