Thermal Conduction Behaviors of Single-ply Broken Twill Weave Reinforced Thermally Induced Resin-based Shape Memory Polymer Composites: Multi-scale Method Analysis and Laser Flash Analysis

Yang Tianyang,Chen Wujun,Hu Jianhui,Zhao Bing,Fang Guangqiang,Peng Fujun,Cao Zhengli
DOI: https://doi.org/10.1007/s10443-021-09977-w
IF: 2.3
2021-01-01
Applied Composite Materials
Abstract:Temperature is a paramount factor for shape memory polymer composites (SMPCs) to implement their shape recovery functions and present their high specific stiffness when applied in aerospace deployable structures. However, many existing studies focused on the thermo-mechanics and shape memory behaviors of SMPC were established based on uniform temperature distribution. This work explores the specific characteristics of thermal conduction behaviors of single-ply carbon fiber broken twill weave reinforced thermally induced resin-based SMPCs by multi-scale analysis method. The thermal conductivities are measured by the laser flash analysis (LFA) method, and the results are modified by the specific heat testing results from differential scanning calorimeter (DSC). The periodical dividing areas and multi-scale representative volume elements (RVEs) are developed to elaborate the thermal conduction behavior and uneven temperature distribution of 3–1 twill weave reinforced SMPCs. Through the finite element analysis (FEA) and comparisons, the particularity of twill breaking woven materials compared with other woven materials is shown. By comparing the experimental and numerical results of thermal conductivities, the multi-scale models and analysis of thermal conduction behavior are validated to be effective.
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