Remarkable Thermoelectric Property Enhancement in Cu2SnS3–CuCo2S4 Nanocomposites Via 3D Modulation Doping

Yan Gu,Wen Ai,Yaqing Zhao,Lin Pan,Chunhua Lu,Pengan Zong,Xiaohui Hu,Zhongzi Xu,Yifeng Wang
DOI: https://doi.org/10.1039/d1ta02812j
IF: 11.9
2021-01-01
Journal of Materials Chemistry A
Abstract:Modulation doping due to charge transfer at interfaces with an appropriate band alignment led to a large power factor and a high ZT (∼0.83 at 773 K) in a Cu2SnS3-5 mol% CuCo2S4 composite with a superior carrier mobility to uniformly doped Cu2SnS3.
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