Mission Profile Emulation for Flexible Number of Submodules in Modular Multilevel Converters with Nearest Level Modulation

Shan Jiang,Ke Ma,Yunxiao Yan,Xu Cai

DOI: https://doi.org/10.1109/tie.2021.3128918

IF: 7.7

2021-01-01

IEEE Transactions on Industrial Electronics

Abstract:Mission profile emulation (MPE) for submodules (SMs) in the modular multilevel converter (MMC) is a crucial step before a full-scale system is put into field operation. Existing methods suffer from limitations of the testing accuracy due to the staircase-like arm voltages that result in distorted loading current and require large filter inductance. This is especially the case when a limited number of SMs are under test. In this article, an efficient MPE method is proposed to emulate the loading behaviors of multiple SMs in MMC. The testing circuit allows two arms of MMC with flexible SM number, operating in inverting and rectifying mode under nearest level modulation, to be tested simultaneously with reduced dc supply voltage. A common H-bridge circuit is introduced in the testing circuit, with each arm of the H-bridge circuit functioning as the voltage compensator by using feedforward control. In this way, the current distortion can be significantly suppressed, and testing accuracy can be guaranteed in a cost-efficient manner even though no large inductor is included in the testing circuit. The proposed method allows SMs under test to be loaded as in the actual back-to-back MMC system. Simulations and experimental measurements are given to validate the proposed method.