Surface Modification and Bonding of Poly(dimethylsiloxane) by Oxygen Plasma Treatment under Medium Vacuum

De-xin SHEN,Feng ZHANG,Chun-quan ZHANG,Zhong-zi LUO,Zhi-yang CHEN,Yong-liang ZHOU
DOI: https://doi.org/10.3321/j.issn:0438-0479.2005.06.013
2005-01-01
Abstract:Bonding is one of key processes for fabrication of microfluidic chip.Normally poly(dimethylsiloxane)(PDMS) replica,the most popular microfluidic chip material,were bonded after activated by oxygen plasma in high vacuum(pressure lower than 10 Pa),which need expensive pumps.Here a method was developed for modifying and bonding PDMS replicas in middle vacuum(pressure higher than 13.3 Pa) by oxygen plasma.After treated by oxygen plasma 2~70 s in a system equipped with a normal oil pump(background vacuum 27 Pa),the PDMS replicas were irreversibly sealed when the treated surfaces were brought into touch.Operation parameters,irritation voltage and treatment time,were optimized.And the hydrophilic behavior of PDMS was improved greatly after activating and then decreased slowly to hydrophobic as same as before treatment,but could be kept for a long time by immersed into water immediately after bonding.Compared with the reported procedures using oxygen plasma pretreatment under high vacuum,the presented approach needs simpler and cheaper equipment,and has a higher efficiency.And the bonded chip has same intensity and surface properties,which was proved by FTIR,TEM and contact angle measurement.Other polymer microfluidic replica,e.g.,PMMA,PET,PC etc could be activated and sealed by this method too.
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