Thermal-Structure Coupling Analysis of Microgravity Environment Simulation Suspension Structure for Large Space Deployable Mechanisms

ZHANG Liangjun,LI Xiaoci,WU Jingyi,CAI Aifeng
DOI: https://doi.org/10.16183/j.cnki.jsjtu.2017.08.009
2017-01-01
Abstract:This article focuses on a microgravity environment simulation suspension device which used for reliability demonstration testing of large-scale space deployable mechanisms.The finite element model of the device is established by Solidworks and the thermal-structure coupling analysis of the suspension device is performed with ANSYS software in the situations of different suspension loadings and temperatures.The thermal deformation and equivalent stress distributions in different conditions of the suspension device are carried out by numerical analysis.The impact of the thermal-structure coupling effect on the tilt angle of long slide rails is discussed.The results provide a reference for optimization design of the microgravity environment simulation suspension device under thermal environment.Besides,the research is also important to guide the actual operation of microgravity and thermal deployment testing and the experimental parameters debugging.
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