Numerical Study on Flow and Heat Transfer Characteristics of Air in A New CPU Heat Sink

Li-na YI,Wen-long ZHENG,Bo-jie WANG,Wen WANG
DOI: https://doi.org/10.3969/j.issn.2095-4468.2015.01.109
2015-01-01
Abstract:Aiming at the insufficient heat exchange performance of rectangular channel fin heat sink for electronic chips, a new heat sink with interrupted and folded fins was proposed. Numerical simulations on the flow and heat transfer of air in single flow channel for the two kinds of heat sink mentioned above were performed. The parameters of f,j, dimensionless factor (j/f) 1/3 andδwere comprehensively analyzed, and the results show that interrupted and folded fins can make fluid boundary layer thickness thinner and promote disturbances, thus the convection heat transfer was enhanced. According to field synergy theory and generalized temperature gradient uniformity principle, the inherent laws of heat transfer enhancement was deeply excavated. The new structure is proved to be superior to the rectangular structure. Moreover, the result provides a reference to the design of heat sink for cooling the electronic chips.
What problem does this paper attempt to address?