Microencapsulation Technologies for Adhesives and Characterization of the Microcapsules

Yangbao MA,Yanhua ZHANG,Haiyan TAN,Jiyou GU
DOI: https://doi.org/10.11896/j.issn.1005-023X.2016.23.006
2016-01-01
Abstract:The present review concerns the application of microencapsulation technology to adhesives.The de-velopment,preparation methods and materials of microcapsules are outlined,and the release behaviors for microcap-sules-based adhesives are briefly introduced.Former researches which focused on microencapsulation technology for adhesives are summarized,from the perspectives of adhesive materials,curing agents,solvents,etc.The characte-rization methods of microcapsules in adhesives are also described in detail.The paper ends with a prospect over the fu-ture research.
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