Abstract:In this paper,the interfacial reactions and interfaciallic compounds (IMC) between liquid Sn3.0Ag 0.5 Cu solder and Cu,Fe and Cosubstrateduring different soldering time and constant temperature 380 ℃ were studied.The results indicate that with the increase of soldering time,the average thickness of the three IMCs increases gradually.IMC composition of Sn3.0Ag0.5Cu/Cu interface is Cu6Sn5and Cu3Sn,but the main component of the interface IMC isCu3Sn after a long time of soldering.IMC composition of Sn3.0Ag0.5Cu/Fe interface is FeSn2,which grows slowly and forms the smallest thickness during soldering process compared to the other two interfaces.When soldering for a short time (1 min),Sn3.0Ag0.5Cu/Cointerface will divide into two layers.It is considered that a small amount of CoSn2 and Sn atoms react with each other to form CoSn3 near the side of the solder,and CoSn2 is generated near the substrate side.After prolonged soldering,only the CoSn3 was observed in the IMC.By fitting the data,the growth rate constants of the IMC layer of Sn3.0Ag0.5Cu/Cu,Fe and Co were 9.55 × 10-6t0.34,1.51 × 10-6t0.18,0.85 × 10-6t0.45,respectively.Compared with the three substrates,the interfacial reaction rate of liquid Sn-based solder and Cu substrate was the fastest,and the average thickness of IMC was also thicker.

Study on interfacial reaction of liquid Sn3.0Ag0.5Cu solder with Cu, Fe and Co substrate