Heat Dissipation Design of Linear Amplifying Variable Frequency Power Supply

Chunyang ZHU,Hongjie LI,Zhe HOU,Haojie SUN,Mengxin ZHU,Yufei CHEN

DOI: https://doi.org/10.19457/j.1001-2095.20170416

2017-01-01

Abstract:Given that the linear amplifying variable frequency power supply is easily affected by temperature,a heat dissipation system was developed. Both the accurate and approximate calculation methods for the total power dissipation of silicon power transistors used in the variable frequency power supply were proposed via detailed derivation. The heat flow path was described by the thermal resistance equivalent circuit,and the formula of junction temperature with respect to thermal resistance was presented. Based on the above analysis,a forced air cooling heat dissipation system which was applicable on variable frequency power supply was developed by optimizing the design of heat sink,ducts of heat dissipation and ventilator. The temperature filed of variable frequency power supply was simulated by employing Icepak. The comparison between the simulation and experiment results validate the design scheme.