Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity
Gang Li,Baotan Zhang,Pengli Zhu,Jinze Li,R. Sun,C. Wong
DOI: https://doi.org/10.1109/ICEPT.2017.8046635
2017-08-01
Abstract:The novel liquid epoxy moulding compound (EMC) material with high thermally conductive and good heated resistance was prepared by epoxy, cyanate and alumina filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, SEM, TGA, TMA and DMA, respectively. The results showed that the cyanate ester modified epoxy and its composite with alumina filler made the glass transition temperature over 212.7 °C and the thermal decomposition temperature (5% wt loss) up to 410 °C, indicating that it has good thermal stability. With an increase in Al2O3 fillers loading, the coefficient of thermal conductivity rose from 0.21 to 2.87 W/m·K at 90 wt% fillers. This indicated that the novel EMC material has excellent thermally conductivity, which can be used for fan-out wafer level packages.
Engineering,Materials Science