Design of LED Module Without Substrate and Its Cylinder Heat Sink Cooling System

Kai YANG,Yanjie OU,Weiwen LV
DOI: https://doi.org/10.14176/j.issn.1001-3474.2017.01.001
2017-01-01
Abstract:A LED module without substrate and its manufacture process are proposed, as well as the design of its cylinder heat sink peripheral cooling system. The LEDs in this module are directly refl owed on the mutually insulated concentric cylinder. Compared with the LED module with the aluminum base circuit board, the new LED module has lower thermal resistance and the LED's junction temperature is also lower. Ansys software is used to analyze and optimize the structure of the module with cylinder heat sink cooling system. And the LED's junction temperature of the module is measured by the forward voltage method. The results show that: LED's junction temperature is 62.7℃ in the rated condition. While in the condition of 50 percent higher than the rated condition, the LED's junction temperature is 83.15℃.
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